Mobile Sempron SI-40 vs i3-2310E

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Primary details

Comparing Core i3-2310E and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking2360not rated
Place by popularitynot in top-100not in top-100
Market segmentLaptopLaptop
SeriesIntel Core i3AMD Mobile Sempron
Power efficiency3.15no data
Architecture codenameSandy Bridge (2011−2013)Sable (2008−2009)
Release date1 February 2011 (13 years ago)4 July 2008 (16 years ago)
Launch price (MSRP)$225no data

Detailed specifications

Core i3-2310E and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores2 (Dual-core)1 (Single-Core)
Threads41
Base clock speed2.1 GHzno data
Boost clock speed2.1 GHz2 GHz
Bus typeDMI 2.0no data
Bus rate4 × 5 GT/s1800 MHz
Multiplier21no data
L1 cache64K (per core)no data
L2 cache256K (per core)512 KB
L3 cache3 MB (shared)no data
Chip lithography32 nm65 nm
Die size149 mm2no data
Maximum core temperatureno data100 °C
Number of transistors624 millionno data
64 bit support++
Windows 11 compatibility--

Compatibility

Information on Core i3-2310E and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration1 (Uniprocessor)no data
SocketIntel BGA1023S1g2
Power consumption (TDP)35 Watt25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-2310E and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.

Instruction set extensionsno data65 nm, 1.075 - 1.125V
FMA+-
AVX+-
Enhanced SpeedStep (EIST)+no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-2310E and Mobile Sempron SI-40 are enumerated here.

VT-x+no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-2310E and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesDDR3no data
Maximum memory size16 GBno data
Max memory channels2no data
Maximum memory bandwidth21.335 GB/sno data
ECC memory support+-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardIntel HD Graphics 3000no data

Pros & cons summary


Recency 1 February 2011 4 July 2008
Physical cores 2 1
Threads 4 1
Chip lithography 32 nm 65 nm
Power consumption (TDP) 35 Watt 25 Watt

i3-2310E has an age advantage of 2 years, 100% more physical cores and 300% more threads, and a 103.1% more advanced lithography process.

Mobile Sempron SI-40, on the other hand, has 40% lower power consumption.

We couldn't decide between Core i3-2310E and Mobile Sempron SI-40. We've got no test results to judge.


Should you still have questions on choice between Core i3-2310E and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.

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Intel Core i3-2310E
Core i3-2310E
AMD Mobile Sempron SI-40
Mobile Sempron SI-40

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