Sempron 3400+ vs Xeon L5609

Primary details

Comparing Xeon L5609 and Sempron 3400+ processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1883	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Server	Desktop processor
Power efficiency	4.92	no data
Architecture codename	Westmere-EP (2010−2011)	Palermo (2001−2005)
Release date	16 March 2010 (14 years ago)	1 October 2005 (19 years ago)
Launch price (MSRP)	no data	$30

Detailed specifications

Xeon L5609 and Sempron 3400+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	1 (Single-Core)
Threads	4	1
Base clock speed	1.86 GHz	no data
Boost clock speed	1.86 GHz	2 GHz
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	128 KB
L3 cache	12 MB (shared)	0 KB
Chip lithography	32 nm	90 nm
Die size	239 mm2	103 mm2
Maximum core temperature	63 °C	no data
Number of transistors	1,170 million	63 million
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Xeon L5609 and Sempron 3400+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	2	1
Socket	FCLGA1366,LGA1366	939
Power consumption (TDP)	40 Watt	62 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon L5609 and Sempron 3400+. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.2	no data
AES-NI	+	-
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Demand Based Switching	+	no data
PAE	40 Bit	no data

Security technologies

Xeon L5609 and Sempron 3400+ technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon L5609 and Sempron 3400+ are enumerated here.

VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon L5609 and Sempron 3400+. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR1
Maximum memory size	288 GB	no data
Max memory channels	3	no data
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card

no data

On certain motherboards (Chipset feature)

Peripherals

Specifications and connection of peripherals supported by Xeon L5609 and Sempron 3400+.

PCIe version

2.0

no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	16 March 2010	1 October 2005
Physical cores	4	1
Threads	4	1
Chip lithography	32 nm	90 nm
Power consumption (TDP)	40 Watt	62 Watt

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