i3-370M vs Sempron 3850
Aggregate performance score
Core i3-370M outperforms Sempron 3850 by a minimal 1% based on our aggregate benchmark results.
Primary details
Comparing Sempron 3850 and Core i3-370M processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2677 | 2670 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Desktop processor | Laptop |
| Series | no data | Intel Core i3 |
| Power efficiency | 2.74 | 1.98 |
| Architecture codename | Kabini (2013−2014) | Arrandale (2010−2011) |
| Release date | 9 April 2014 (10 years ago) | 22 June 2010 (14 years ago) |
| Launch price (MSRP) | no data | $245 |
Detailed specifications
Sempron 3850 and Core i3-370M basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 2 (Dual-core) |
| Threads | 4 | 4 |
| Base clock speed | no data | 2.4 GHz |
| Boost clock speed | 1.3 GHz | 0.1 GHz |
| Bus type | no data | DMI 1.0 |
| Bus rate | no data | 1 × 2.5 GT/s |
| Multiplier | no data | 18 |
| L1 cache | 256 KB | 128 KB |
| L2 cache | 2048 KB | 512 KB |
| L3 cache | no data | 3 MB (shared) |
| Chip lithography | 28 nm | 32 nm |
| Die size | 107 mm2 | 81+114 mm2 |
| Maximum core temperature | 90 °C | 90 °C for rPGA, 105 °C for BGA |
| Maximum case temperature (TCase) | 90 °C | no data |
| Number of transistors | no data | 382+177 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Sempron 3850 and Core i3-370M compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | AM1 | PGA988 |
| Power consumption (TDP) | 25 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Sempron 3850 and Core i3-370M. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | Intel® SSE4.1, Intel® SSE4.2 |
| AES-NI | + | - |
| FMA | FMA4 | + |
| AVX | + | - |
| PowerNow | + | - |
| PowerGating | + | - |
| VirusProtect | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | + |
| PAE | no data | 36 Bit |
| FDI | no data | + |
| Fast Memory Access | no data | + |
Security technologies
Sempron 3850 and Core i3-370M technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Sempron 3850 and Core i3-370M are enumerated here.
| AMD-V | + | - |
| VT-d | no data | - |
| VT-x | no data | + |
| EPT | no data | + |
| IOMMU 2.0 | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Sempron 3850 and Core i3-370M. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3-1600 | DDR3 |
| Maximum memory size | no data | 8 GB |
| Max memory channels | 1 | 2 |
| Maximum memory bandwidth | no data | 17.051 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon R3 Graphics | Intel® HD Graphics for Previous Generation Intel® Processors |
| Number of pipelines | 128 | no data |
| Clear Video | no data | + |
| Clear Video HD | no data | + |
| Enduro | + | - |
| Switchable graphics | + | - |
| UVD | + | - |
| VCE | + | - |
| Graphics max frequency | no data | 667 MHz |
Graphics interfaces
Available interfaces and connections of Sempron 3850 and Core i3-370M integrated GPUs.
| Number of displays supported | no data | 2 |
| DisplayPort | + | - |
| HDMI | + | - |
Graphics API support
APIs supported by Sempron 3850 and Core i3-370M integrated GPUs, sometimes API versions are included.
| DirectX | DirectX® 12 | no data |
| Vulkan | + | - |
Peripherals
Specifications and connection of peripherals supported by Sempron 3850 and Core i3-370M.
| PCIe version | 2.0 | 2.0 |
| PCI Express lanes | 4 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Pros & cons summary
| Performance score | 0.75 | 0.76 |
| Recency | 9 April 2014 | 22 June 2010 |
| Physical cores | 4 | 2 |
| Chip lithography | 28 nm | 32 nm |
| Power consumption (TDP) | 25 Watt | 35 Watt |
Sempron 3850 has an age advantage of 3 years, 100% more physical cores, a 14.3% more advanced lithography process, and 40% lower power consumption.
i3-370M, on the other hand, has a 1.3% higher aggregate performance score.
Given the minimal performance differences, no clear winner can be declared between Sempron 3850 and Core i3-370M.
Note that Sempron 3850 is a desktop processor while Core i3-370M is a notebook one.
Should you still have questions on choice between Sempron 3850 and Core i3-370M, ask them in Comments section, and we shall answer.
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