Mobile Sempron SI-42 vs m7-6Y75

Place in the ranking	2171	3219
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Core m7	AMD Mobile Sempron
Power efficiency	27.84	0.80
Architecture codename	Skylake-Y (2015)	Sable (2008−2009)
Release date	1 September 2015 (9 years ago)	1 September 2009 (15 years ago)
Launch price (MSRP)	$393	no data

Detailed specifications

Core m7-6Y75 and Mobile Sempron SI-42 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	4	1
Base clock speed	1.2 GHz	no data
Boost clock speed	3.1 GHz	2.1 GHz
Bus type	DMI 3.0	no data
Bus rate	4 GT/s	1800 MHz
Multiplier	12	no data
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	512 KB
L3 cache	4 MB (shared)	no data
Chip lithography	14 nm	65 nm
Die size	98.57 mm²	no data
Maximum core temperature	100 °C	100 °C
Number of transistors	1750 Million	no data
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Core m7-6Y75 and Mobile Sempron SI-42 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	no data
Socket	FCBGA1515	S1g2
Power consumption (TDP)	4.5 Watt	25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core m7-6Y75 and Mobile Sempron SI-42. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	65 nm, 1.075 - 1.125
AES-NI	+	-
AVX	+	-
vPro	+	no data
Enhanced SpeedStep (EIST)	+	no data
My WiFi	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
TSX	+	-
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
SIPP	+	-
Smart Response	+	no data

Security technologies

Core m7-6Y75 and Mobile Sempron SI-42 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Secure Key	+	no data
MPX	+	-
SGX	Yes with Intel® ME	no data
OS Guard	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core m7-6Y75 and Mobile Sempron SI-42 are enumerated here.

AMD-V	+	-
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core m7-6Y75 and Mobile Sempron SI-42. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	no data
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	29.861 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 515	no data
Max video memory	16 GB	no data
Quick Sync Video	+	-
Clear Video	+	no data
Clear Video HD	+	no data
Graphics max frequency	1 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core m7-6Y75 and Mobile Sempron SI-42 integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
DVI	+	no data

Graphics image quality

Maximum display resolutions supported by Core m7-6Y75 and Mobile Sempron SI-42 integrated GPUs, including resolutions over different interfaces.

4K resolution support	+	no data
Max resolution over HDMI 1.4	4096x2304@24Hz	no data
Max resolution over eDP	3840x2160@60Hz	no data
Max resolution over DisplayPort	3840x2160@60Hz	no data

Graphics API support

APIs supported by Core m7-6Y75 and Mobile Sempron SI-42 integrated GPUs, sometimes API versions are included.

DirectX	12	no data
OpenGL	4.5	no data

Peripherals

Specifications and connection of peripherals supported by Core m7-6Y75 and Mobile Sempron SI-42.

PCIe version	3.0	no data
PCI Express lanes	10	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

Combined synthetic benchmark score

This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.

m7-6Y75 1.47
+600%

Mobile Sempron SI-42 0.21

3DMark06 CPU

3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.

m7-6Y75 2730
+247%

Mobile Sempron SI-42 787

wPrime 32

wPrime 32M is a math multi-thread processor test, which calculates square roots of first 32 million integer numbers. Its result is measured in seconds, so that the less is benchmark result, the faster the processor.

m7-6Y75 19
+300%

Mobile Sempron SI-42 76

Gaming performance

Pros & cons summary

Performance score	1.47	0.21
Recency	1 September 2015	1 September 2009
Physical cores	2	1
Threads	4	1
Chip lithography	14 nm	65 nm
Power consumption (TDP)	4 Watt	25 Watt

m7-6Y75 has a 600% higher aggregate performance score, an age advantage of 6 years, 100% more physical cores and 300% more threads, a 364.3% more advanced lithography process, and 525% lower power consumption.

The Core m7-6Y75 is our recommended choice as it beats the Mobile Sempron SI-42 in performance tests.

Should you still have questions on choice between Core m7-6Y75 and Mobile Sempron SI-42, ask them in Comments section, and we shall answer.