Mobile Sempron 200U vs Xeon W3670

Primary details

Comparing Xeon W3670 and Mobile Sempron 200U processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1402	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	2.12	no data
Market segment	Server	Laptop
Series	no data	AMD Mobile Sempron
Power efficiency	2.96	no data
Architecture codename	Gulftown (2010−2011)	Huron (2009)
Release date	29 August 2010 (14 years ago)	16 January 2009 (15 years ago)
Launch price (MSRP)	$295	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon W3670 and Mobile Sempron 200U basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	6 (Hexa-Core)	1 (Single-Core)
Threads	12	1
Base clock speed	3.2 GHz	no data
Boost clock speed	3.46 GHz	1 GHz
Bus rate	no data	1600 MHz
L1 cache	64 KB (per core)	no data
L2 cache	256 KB (per core)	256 KB
L3 cache	12 MB (shared)	no data
Chip lithography	32 nm	65 nm
Die size	239 mm2	no data
Maximum core temperature	68 °C	no data
Number of transistors	1,170 million	no data
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Xeon W3670 and Mobile Sempron 200U compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	no data
Socket	FCLGA1366	ASB1
Power consumption (TDP)	130 Watt	8 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon W3670 and Mobile Sempron 200U. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.2	AMD64, SSE1-3, MMX
AES-NI	+	-
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	1.0	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Demand Based Switching	+	no data
PAE	36 Bit	no data

Security technologies

Xeon W3670 and Mobile Sempron 200U technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon W3670 and Mobile Sempron 200U are enumerated here.

VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon W3670 and Mobile Sempron 200U. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR2
Maximum memory size	24 GB	no data
Max memory channels	3	no data
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	+	-

Peripherals

Specifications and connection of peripherals supported by Xeon W3670 and Mobile Sempron 200U.

PCIe version

2.0

no data

Pros & cons summary

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Recency	29 August 2010	16 January 2009
Physical cores	6	1
Threads	12	1
Chip lithography	32 nm	65 nm
Power consumption (TDP)	130 Watt	8 Watt

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