A4-7210 vs Xeon L5609

Primary details

Comparing Xeon L5609 and A4-7210 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1857	2396
Place by popularity	not in top-100	not in top-100
Market segment	Server	Laptop
Series	no data	AMD A-Series
Architecture codename	Westmere-EP (2010−2011)	Carrizo-L (2015)
Release date	16 March 2010 (14 years ago)	7 May 2015 (9 years ago)

Detailed specifications

Xeon L5609 and A4-7210 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	4 (Quad-Core)
Threads	4	4
Base clock speed	1.86 GHz	1.8 GHz
Boost clock speed	1.86 GHz	2.2 GHz
L1 cache	64 KB (per core)	no data
L2 cache	256 KB (per core)	2048 KB
L3 cache	12 MB (shared)	no data
Chip lithography	32 nm	28 nm
Die size	239 mm2	no data
Maximum core temperature	63 °C	90 °C
Number of transistors	1,170 million	930 Million
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Xeon L5609 and A4-7210 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	2	no data
Socket	FCLGA1366,LGA1366	FT3b
Power consumption (TDP)	40 Watt	12-25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon L5609 and A4-7210. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.2	MMX, SSE4.2, AES, AVX, BMI1, F16C, AMD64, VT
AES-NI	+	+
FMA	-	FMA4
AVX	-	+
PowerNow	-	+
PowerGating	-	+
VirusProtect	-	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Demand Based Switching	+	no data
PAE	40 Bit	no data
Status	Discontinued	no data

Security technologies

Xeon L5609 and A4-7210 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon L5609 and A4-7210 are enumerated here.

AMD-V	-	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data
IOMMU 2.0	-	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon L5609 and A4-7210. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR3L-1600
Maximum memory size	288 GB	no data
Max memory channels	3	1
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	no data	AMD Radeon R3 Graphics
Enduro	-	+
Switchable graphics	-	+
UVD	-	+
VCE	-	+

Graphics interfaces

Available interfaces and connections of Xeon L5609 and A4-7210 integrated GPUs.

DisplayPort	-	+
HDMI	-	+

Graphics API support

APIs supported by Xeon L5609 and A4-7210 integrated GPUs, sometimes API versions are included.

DirectX	no data	DirectX® 12
Vulkan	-	+

Peripherals

Specifications and connection of peripherals supported by Xeon L5609 and A4-7210.

PCIe version

2.0

2.0

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Combined synthetic benchmark score

This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.

Pros & cons summary

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Performance score	2.14	1.07
Recency	16 March 2010	7 May 2015
Chip lithography	32 nm	28 nm
Power consumption (TDP)	40 Watt	12 Watt

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