Sempron 2650 vs Xeon E5-2650

Primary details

Comparing Xeon E5-2650 and Sempron 2650 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1276	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	3.34	no data
Market segment	Server	Desktop processor
Power efficiency	4.63	no data
Architecture codename	Sandy Bridge-EP (2012)	Kabini (2013−2014)
Release date	6 March 2012 (12 years ago)	9 April 2014 (10 years ago)
Launch price (MSRP)	$91	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E5-2650 and Sempron 2650 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	8 (Octa-Core)	2 (Dual-core)
Threads	16	2
Base clock speed	2 GHz	no data
Boost clock speed	2.8 GHz	1.45 GHz
Bus rate	8 GT/s	no data
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	1024 KB
L3 cache	20480 KB (shared)	no data
Chip lithography	32 nm	28 nm
Die size	435 mm2	107 mm2
Maximum core temperature	77 °C	90 °C
Maximum case temperature (TCase)	no data	90 °C
Number of transistors	2,270 million	no data
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Xeon E5-2650 and Sempron 2650 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	2	1
Socket	FCLGA2011	AM1
Power consumption (TDP)	95 Watt	25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E5-2650 and Sempron 2650. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	no data
AES-NI	+	+
FMA	-	FMA4
AVX	+	+
PowerNow	-	+
PowerGating	-	+
VirusProtect	-	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	-	no data
Demand Based Switching	+	no data

Security technologies

Xeon E5-2650 and Sempron 2650 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E5-2650 and Sempron 2650 are enumerated here.

AMD-V	-	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data
IOMMU 2.0	-	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E5-2650 and Sempron 2650. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR3-1333
Maximum memory size	384 GB	no data
Max memory channels	4	1
Maximum memory bandwidth	51.2 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	no data	AMD Radeon R3 Graphics
Number of pipelines	no data	128
Enduro	-	+
Switchable graphics	-	+
UVD	-	+
VCE	-	+

Graphics interfaces

Available interfaces and connections of Xeon E5-2650 and Sempron 2650 integrated GPUs.

DisplayPort	-	+
HDMI	-	+

Graphics API support

APIs supported by Xeon E5-2650 and Sempron 2650 integrated GPUs, sometimes API versions are included.

DirectX	no data	DirectX® 12
Vulkan	-	+

Peripherals

Specifications and connection of peripherals supported by Xeon E5-2650 and Sempron 2650.

PCIe version	3.0	2.0
PCI Express lanes	40	4

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	6 March 2012	9 April 2014
Physical cores	8	2
Threads	16	2
Chip lithography	32 nm	28 nm
Power consumption (TDP)	95 Watt	25 Watt

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