Core 2 Duo L7100 vs Xeon E3-1230 v3
Primary details
Comparing Xeon E3-1230 v3 and Core 2 Duo L7100 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1361 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 2.93 | no data |
| Market segment | Server | Laptop |
| Series | Xeon (Desktop) | Core 2 Duo |
| Power efficiency | 5.07 | no data |
| Architecture codename | Haswell-WS (2013−2014) | Merom (2006−2008) |
| Release date | 2 June 2013 (11 years ago) | no data (2024 years ago) |
| Launch price (MSRP) | $240 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Xeon E3-1230 v3 and Core 2 Duo L7100 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 2 (Dual-core) |
| Threads | 8 | 2 |
| Base clock speed | 3.3 GHz | no data |
| Boost clock speed | 3.7 GHz | 1.2 GHz |
| Bus rate | 5 GT/s | 800 MHz |
| L1 cache | 64 KB (per core) | no data |
| L2 cache | 256K (per core) | no data |
| L3 cache | 8 MB (shared) | no data |
| Chip lithography | 22 nm | 65 nm |
| Die size | 160 mm2 | no data |
| Number of transistors | 1,400 million | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | - | - |
Compatibility
Information on Xeon E3-1230 v3 and Core 2 Duo L7100 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | FCLGA1150 | no data |
| Power consumption (TDP) | 80 Watt | 17 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon E3-1230 v3 and Core 2 Duo L7100. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | no data |
| AES-NI | + | - |
| AVX | + | - |
| vPro | + | no data |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| SIPP | + | - |
| Fast Memory Access | + | no data |
Security technologies
Xeon E3-1230 v3 and Core 2 Duo L7100 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Secure Key | + | no data |
| Identity Protection | + | - |
| OS Guard | + | no data |
| Anti-Theft | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon E3-1230 v3 and Core 2 Duo L7100 are enumerated here.
| AMD-V | + | - |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon E3-1230 v3 and Core 2 Duo L7100. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 32 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 25.6 GB/s | no data |
| ECC memory support | + | - |
Peripherals
Specifications and connection of peripherals supported by Xeon E3-1230 v3 and Core 2 Duo L7100.
| PCIe version | 3.0 | no data |
| PCI Express lanes | 16 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Cinebench 10 32-bit single-core
Cinebench R10 is an ancient ray tracing benchmark for processors by Maxon, authors of Cinema 4D. Its single core version uses just one CPU thread to render a futuristic looking motorcycle.
Cinebench 10 32-bit multi-core
Cinebench Release 10 Multi Core is a variant of Cinebench R10 using all the processor threads. Possible number of threads is limited by 16 in this version.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Pros & cons summary
| Physical cores | 4 | 2 |
| Threads | 8 | 2 |
| Chip lithography | 22 nm | 65 nm |
| Power consumption (TDP) | 80 Watt | 17 Watt |
Xeon E3-1230 v3 has 100% more physical cores and 300% more threads, and a 195.5% more advanced lithography process.
Core 2 Duo L7100, on the other hand, has 370.6% lower power consumption.
We couldn't decide between Xeon E3-1230 v3 and Core 2 Duo L7100. We've got no test results to judge.
Be aware that Xeon E3-1230 v3 is a server/workstation processor while Core 2 Duo L7100 is a notebook one.
Should you still have questions on choice between Xeon E3-1230 v3 and Core 2 Duo L7100, ask them in Comments section, and we shall answer.
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