Mobile Sempron 200U vs Xeon E3-1220 v5

Primary details

Comparing Xeon E3-1220 v5 and Mobile Sempron 200U processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	1401	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	1.75	no data
Market segment	Server	Laptop
Series	Intel Xeon E3	AMD Mobile Sempron
Architecture codename	Skylake (2015−2016)	Huron (2009)
Release date	19 October 2015 (8 years ago)	16 January 2009 (15 years ago)
Launch price (MSRP)	$203	no data
Current price	$199 (1x MSRP)	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E3-1220 v5 and Mobile Sempron 200U basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	1 (Single-Core)
Threads	4	1
Base clock speed	3 GHz	no data
Boost clock speed	3.5 GHz	1 GHz
Bus support	4 × 8 GT/s	1600 MHz
L1 cache	256 KB	no data
L2 cache	1 MB	256 KB
L3 cache	8 MB	no data
Chip lithography	14 nm	65 nm
Die size	122 mm2	no data
64 bit support	+	+
Windows 11 compatibility	-	-
Unlocked multiplier	No	No

Compatibility

Information on Xeon E3-1220 v5 and Mobile Sempron 200U compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	no data
Socket	FCLGA1151	ASB1
Power consumption (TDP)	80 Watt	8 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E3-1220 v5 and Mobile Sempron 200U. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	AMD64, DDR2 memory controller, SSE1-3, MMX
AES-NI	+	no data
AVX	+	no data
vPro	+	no data
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	-	no data
TSX	+	no data
Idle States	+	no data
Thermal Monitoring	+	no data
Status	Discontinued	no data

Security technologies

Xeon E3-1220 v5 and Mobile Sempron 200U technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Secure Key	+	no data
MPX	+	no data
SGX	Yes with both Intel® SPS and Intel® ME	no data
OS Guard	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E3-1220 v5 and Mobile Sempron 200U are enumerated here.

VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E3-1220 v5 and Mobile Sempron 200U. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR4-1866, DDR4-2133, DDR3L-1333, DDR3L-1600	DDR2
Maximum memory size	64 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	34.1 GB/s	no data
ECC memory support	+	no data

Graphics image quality

Maximum display resolutions supported by Xeon E3-1220 v5 and Mobile Sempron 200U integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	N/A	no data
Max resolution over eDP	N/A	no data
Max resolution over DisplayPort	N/A	no data
Max resolution over VGA	N/A	no data

Graphics API support

APIs supported by Xeon E3-1220 v5 and Mobile Sempron 200U integrated GPUs, sometimes API versions are included.

DirectX	N/A	no data
OpenGL	N/A	no data

Peripherals

Specifications and connection of peripherals supported by Xeon E3-1220 v5 and Mobile Sempron 200U.

PCIe version	3.0	no data
PCI Express lanes	16	no data

Pros & cons summary

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Recency	19 October 2015	16 January 2009
Physical cores	4	1
Threads	4	1
Chip lithography	14 nm	65 nm
Power consumption (TDP)	80 Watt	8 Watt

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