Xeon E7-8867 v3 vs Ryzen AI 9 HX 370
Aggregate performance score
Xeon E7-8867 v3 outperforms Ryzen AI 9 HX 370 by a minimal 4% based on our aggregate benchmark results.
Primary details
Comparing Ryzen AI 9 HX 370 and Xeon E7-8867 v3 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 233 | 220 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Server |
| Power efficiency | 75.34 | 13.33 |
| Architecture codename | Strix Point (2024) | Haswell-EX (2015) |
| Release date | July 2024 (recently) | 1 June 2015 (9 years ago) |
Detailed specifications
Ryzen AI 9 HX 370 and Xeon E7-8867 v3 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 16 (Hexadeca-Core) |
| Threads | 24 | 32 |
| Base clock speed | 2 GHz | 2.5 GHz |
| Boost clock speed | 5.1 GHz | 3.3 GHz |
| Bus rate | 54 MHz | 9.6 GT/s |
| L1 cache | 80 KB (per core) | 64K (per core) |
| L2 cache | 1 MB (per core) | 256K (per core) |
| L3 cache | 24 MB (shared) | 45 MB (shared) |
| Chip lithography | 4 nm | 22 nm |
| Die size | no data | 160 mm2 |
| Maximum core temperature | 100 °C | no data |
| Maximum case temperature (TCase) | no data | 79 °C |
| Number of transistors | no data | 1,400 million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 370 and Xeon E7-8867 v3 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 8 |
| Socket | FP8 | FCLGA2011 |
| Power consumption (TDP) | 28 Watt | 165 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 370 and Xeon E7-8867 v3. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | Intel® AVX2 |
| AES-NI | + | + |
| AVX | + | + |
| vPro | no data | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | 2.0 |
| Hyper-Threading Technology | no data | + |
| TSX | - | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| PAE | no data | 46 Bit |
| Precision Boost 2 | + | no data |
Security technologies
Ryzen AI 9 HX 370 and Xeon E7-8867 v3 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
| EDB | no data | + |
| Secure Key | no data | + |
| OS Guard | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 370 and Xeon E7-8867 v3 are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 370 and Xeon E7-8867 v3. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4-1333/1600/1866, DDR3-1066/1333/1600 |
| Maximum memory size | no data | 1.5 TB |
| Max memory channels | no data | 4 |
| Maximum memory bandwidth | no data | 85 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | no data |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 370 and Xeon E7-8867 v3.
| PCIe version | 4.0 | 3.0 |
| PCI Express lanes | 16 | 32 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 22.29 | 23.24 |
| Physical cores | 12 | 16 |
| Threads | 24 | 32 |
| Chip lithography | 4 nm | 22 nm |
| Power consumption (TDP) | 28 Watt | 165 Watt |
Ryzen AI 9 HX 370 has a 450% more advanced lithography process, and 489.3% lower power consumption.
Xeon E7-8867 v3, on the other hand, has a 4.3% higher aggregate performance score, and 33.3% more physical cores and 33.3% more threads.
Given the minimal performance differences, no clear winner can be declared between Ryzen AI 9 HX 370 and Xeon E7-8867 v3.
Be aware that Ryzen AI 9 HX 370 is a notebook processor while Xeon E7-8867 v3 is a server/workstation one.
Should you still have questions on choice between Ryzen AI 9 HX 370 and Xeon E7-8867 v3, ask them in Comments section, and we shall answer.
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