Ryzen 9 7950X3D vs Pentium 4 1.3
Primary details
Comparing Pentium 4 1.3 and Ryzen 9 7950X3D processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 67 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 53.47 |
| Market segment | Desktop processor | Desktop processor |
| Series | no data | AMD Ryzen 9 |
| Power efficiency | no data | 31.03 |
| Architecture codename | Willamette (2000−2001) | Raphael (Zen4) (2022−2023) |
| Release date | January 2001 (23 years ago) | 4 January 2023 (1 year ago) |
| Launch price (MSRP) | no data | $699 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Pentium 4 1.3 and Ryzen 9 7950X3D basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 16 (Hexadeca-Core) |
| Threads | 1 | 32 |
| Base clock speed | no data | 4.2 GHz |
| Boost clock speed | 1.3 GHz | 5.7 GHz |
| Bus rate | no data | 64K (per core) |
| L1 cache | 8 KB | 1024 KB |
| L2 cache | 256 KB | 16 MB |
| L3 cache | 0 KB | 128 MB (shared) |
| Chip lithography | 180 nm | 5 nm, 6 nm |
| Die size | 217 mm2 | 71+71+122 mm |
| Maximum core temperature | no data | 89 °C |
| Maximum case temperature (TCase) | 70 °C | 47 °C |
| Number of transistors | 42 million | 13,140 million |
| 64 bit support | - | + |
| Windows 11 compatibility | - | + |
| Unlocked multiplier | - | + |
Compatibility
Information on Pentium 4 1.3 and Ryzen 9 7950X3D compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | 478 | AM5 |
| Power consumption (TDP) | 52 Watt | 120 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Pentium 4 1.3 and Ryzen 9 7950X3D. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | 86x MMX(+), SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A,-64, AMD-V, AES, AVX, AVX2, AVX512F, FMA3, SHA, XFR2, Precision Boost 2 |
| AES-NI | - | + |
| AVX | - | + |
| Precision Boost 2 | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Pentium 4 1.3 and Ryzen 9 7950X3D are enumerated here.
| AMD-V | - | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Pentium 4 1.3 and Ryzen 9 7950X3D. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR1, DDR2 | DDR5-5200 |
| Maximum memory size | no data | 128 GB |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon Graphics (Ryzen 7000) |
Peripherals
Specifications and connection of peripherals supported by Pentium 4 1.3 and Ryzen 9 7950X3D.
| PCIe version | no data | 5.0 |
| PCI Express lanes | no data | 24 |
Pros & cons summary
| Physical cores | 1 | 16 |
| Threads | 1 | 32 |
| Chip lithography | 180 nm | 5 nm |
| Power consumption (TDP) | 52 Watt | 120 Watt |
Pentium 4 1.3 has 130.8% lower power consumption.
Ryzen 9 7950X3D, on the other hand, has 1500% more physical cores and 3100% more threads, and a 3500% more advanced lithography process.
We couldn't decide between Pentium 4 1.3 and Ryzen 9 7950X3D. We've got no test results to judge.
Should you still have questions on choice between Pentium 4 1.3 and Ryzen 9 7950X3D, ask them in Comments section, and we shall answer.
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