Ryzen AI 7 PRO 360 vs Mobile Sempron 3300+
Primary details
Comparing Mobile Sempron 3300+ and Ryzen AI 7 PRO 360 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 442 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Mobile Sempron | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | no data | 52.48 |
| Architecture codename | Roma (2005) | Strix Point (Zen 5) (2024) |
| Release date | 1 June 2005 (19 years ago) | 1 October 2024 (less than a year ago) |
Detailed specifications
Mobile Sempron 3300+ and Ryzen AI 7 PRO 360 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 8 (Octa-Core) |
| Threads | 1 | 16 AMD Zen 5 AMD Zen 5c |
| Boost clock speed | 2 GHz | 5.1 GHz |
| Bus rate | 800 MHz | 54 MHz |
| L2 cache | 128 KB | no data |
| Chip lithography | 90 nm | 4 nm |
| 64 bit support | - | + |
| Windows 11 compatibility | - | no data |
Compatibility
Information on Mobile Sempron 3300+ and Ryzen AI 7 PRO 360 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | 745 | FP8 |
| Power consumption (TDP) | 62/25 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Mobile Sempron 3300+ and Ryzen AI 7 PRO 360. You'll probably need this information if you require some particular technology.
| Instruction set extensions | MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit | USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | - | + |
| AVX | - | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Mobile Sempron 3300+ and Ryzen AI 7 PRO 360. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR5 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon 880M |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Recency | 1 June 2005 | 1 October 2024 |
| Physical cores | 1 | 8 |
| Threads | 1 | 16 AMD Zen 5 AMD Zen 5c |
| Chip lithography | 90 nm | 4 nm |
| Power consumption (TDP) | 62 Watt | 28 Watt |
Ryzen AI 7 PRO 360 has an age advantage of 19 years, 700% more physical cores and 1500% more threads, a 2150% more advanced lithography process, and 121.4% lower power consumption.
We couldn't decide between Mobile Sempron 3300+ and Ryzen AI 7 PRO 360. We've got no test results to judge.
Should you still have questions on choice between Mobile Sempron 3300+ and Ryzen AI 7 PRO 360, ask them in Comments section, and we shall answer.
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