Mobile Sempron 3300+ vs Ryzen AI 9 HX 375
Primary details
Comparing Ryzen AI 9 HX 375 and Mobile Sempron 3300+ processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 259 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | AMD Mobile Sempron |
| Power efficiency | 36.24 | no data |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Roma (2005) |
| Release date | 25 July 2024 (less than a year ago) | 1 June 2005 (19 years ago) |
Detailed specifications
Ryzen AI 9 HX 375 and Mobile Sempron 3300+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 1 (Single-Core) |
| Threads | 24 | 1 |
| Base clock speed | 2 GHz | no data |
| Boost clock speed | 5.1 GHz | 2 GHz |
| Bus rate | no data | 800 MHz |
| L2 cache | 12 MB | 128 KB |
| L3 cache | 24 MB | no data |
| Chip lithography | 4 nm | 90 nm |
| Maximum core temperature | 100 °C | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Mobile Sempron 3300+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | FP8 | 745 |
| Power consumption (TDP) | 54 Watt | 62/25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Mobile Sempron 3300+. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit |
| AES-NI | + | - |
| AVX | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Mobile Sempron 3300+. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Recency | 25 July 2024 | 1 June 2005 |
| Physical cores | 12 | 1 |
| Threads | 24 | 1 |
| Chip lithography | 4 nm | 90 nm |
| Power consumption (TDP) | 54 Watt | 62 Watt |
Ryzen AI 9 HX 375 has an age advantage of 19 years, 1100% more physical cores and 2300% more threads, a 2150% more advanced lithography process, and 14.8% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 375 and Mobile Sempron 3300+. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Mobile Sempron 3300+, ask them in Comments section, and we shall answer.
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