Pentium 4 HT Extreme Edition 3.40 vs i3-370M

Primary details

Comparing Core i3-370M and Pentium 4 HT Extreme Edition 3.40 processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	2645	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Desktop processor
Series	Intel Core i3	no data
Architecture codename	Arrandale (2010−2011)	Gallatin (2003−2004)
Release date	22 June 2010 (14 years ago)	2 February 2004 (20 years ago)
Launch price (MSRP)	$245	no data

Detailed specifications

Core i3-370M and Pentium 4 HT Extreme Edition 3.40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	4	2
Base clock speed	2.4 GHz	3.4 GHz
Boost clock speed	0.1 GHz	3.4 GHz
Bus type	DMI 1.0	no data
Bus rate	1 × 2.5 GT/s	no data
Multiplier	18	no data
L1 cache	128 KB	8 KB
L2 cache	512 KB	512 KB
L3 cache	3 MB	2 MB
Chip lithography	32 nm	130 nm
Die size	81+114 mm2	269 mm2
Maximum core temperature	90 °C for rPGA, 105 °C for BGA	no data
Maximum case temperature (TCase)	no data	69 °C
Number of transistors	382+177 Million	178 million
64 bit support	+	-
Windows 11 compatibility	-	no data

Compatibility

Information on Core i3-370M and Pentium 4 HT Extreme Edition 3.40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	PGA988	478
Power consumption (TDP)	35 Watt	103 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-370M and Pentium 4 HT Extreme Edition 3.40. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
FMA	+	-
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
PAE	36 Bit	no data
FDI	+	no data
Fast Memory Access	+	no data
Status	Discontinued	no data

Security technologies

Core i3-370M and Pentium 4 HT Extreme Edition 3.40 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-370M and Pentium 4 HT Extreme Edition 3.40 are enumerated here.

VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-370M and Pentium 4 HT Extreme Edition 3.40. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR1, DDR2, DDR3 Depends on motherboard
Maximum memory size	8 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	17.051 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for Previous Generation Intel® Processors	no data
Clear Video	+	no data
Clear Video HD	+	no data
Graphics max frequency	667 MHz	no data

Graphics interfaces

Available interfaces and connections of Core i3-370M and Pentium 4 HT Extreme Edition 3.40 integrated GPUs.

Number of displays supported

2

no data

Peripherals

Specifications and connection of peripherals supported by Core i3-370M and Pentium 4 HT Extreme Edition 3.40.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Pros & cons summary

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Recency	22 June 2010	2 February 2004
Physical cores	2	1
Threads	4	2
Chip lithography	32 nm	130 nm
Power consumption (TDP)	35 Watt	103 Watt

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