Xeon Platinum 9282 vs i3-2350M

Primary details

Comparing Core i3-2350M and Xeon Platinum 9282 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2612	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Core i3	Intel Xeon Platinum
Power efficiency	2.14	no data
Architecture codename	Sandy Bridge (2011−2013)	Cascade Lake-AP (2019)
Release date	1 October 2011 (13 years ago)	2 April 2019 (5 years ago)
Launch price (MSRP)	$225	no data

Detailed specifications

Core i3-2350M and Xeon Platinum 9282 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	56 (Hexapentaconta-Core)
Threads	4	112
Base clock speed	2.3 GHz	2.6 GHz
Boost clock speed	2.3 GHz	3.8 GHz
Bus type	DMI 2.0	DMI 3.0
Bus rate	4 × 5 GT/s	4 × 8 GT/s
Multiplier	23	26
L1 cache	64K (per core)	64K (per core)
L2 cache	256K (per core)	1 MB (per core)
L3 cache	3 MB (shared)	77 MB (shared)
Chip lithography	32 nm	14 nm
Die size	149 mm2	no data
Maximum core temperature	85C (PGA); 100C (BGA)	no data
Number of transistors	624 million	8,000 million
64 bit support	+	+
Windows 11 compatibility	-	+

Compatibility

Information on Core i3-2350M and Xeon Platinum 9282 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	8
Socket	FCBGA1023,PPGA988	Intel BGA5903
Power consumption (TDP)	35 Watt	400 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-2350M and Xeon Platinum 9282. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	Intel® AVX-512
AES-NI	-	+
FMA	+	+
AVX	+	+
PowerNow	-	+
vPro	no data	+
Enhanced SpeedStep (EIST)	+	+
Speed Shift	no data	+
My WiFi	+	no data
Turbo Boost Technology	-	2.0
Hyper-Threading Technology	+	+
TSX	-	+
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
SIPP	-	+
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Precision Boost 2	no data	+

Security technologies

Core i3-2350M and Xeon Platinum 9282 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	+
EDB	+	no data
Identity Protection	+	-
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-2350M and Xeon Platinum 9282 are enumerated here.

AMD-V	+	+
VT-d	-	+
VT-x	+	+
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-2350M and Xeon Platinum 9282. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4-2933
Maximum memory size	16 GB	2 TiB
Max memory channels	2	12
Maximum memory bandwidth	21.335 GB/s	281.6 GB/s

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 3000	no data
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.15 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i3-2350M and Xeon Platinum 9282 integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Core i3-2350M and Xeon Platinum 9282.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Pros & cons summary

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Recency	1 October 2011	2 April 2019
Physical cores	2	56
Threads	4	112
Chip lithography	32 nm	14 nm
Power consumption (TDP)	35 Watt	400 Watt

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