Xeon L5215 vs i3-2100
Primary details
Comparing Core i3-2100 and Xeon L5215 processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 2352 | not rated |
Place by popularity | 100 | not in top-100 |
Cost-effectiveness evaluation | 0.28 | no data |
Market segment | Desktop processor | Server |
Power efficiency | 1.70 | no data |
Architecture codename | Sandy Bridge (2011−2013) | no data |
Release date | 20 February 2011 (13 years ago) | 1 July 2008 (16 years ago) |
Launch price (MSRP) | $73 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core i3-2100 and Xeon L5215 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 2 (Dual-core) | no data |
Threads | 4 | no data |
Base clock speed | 3.1 GHz | 1.86 GHz |
Boost clock speed | 3.1 GHz | no data |
Bus rate | 5 GT/s | no data |
L1 cache | 64 KB (per core) | no data |
L2 cache | 256 KB (per core) | no data |
L3 cache | 3 MB (shared) | 6 MB L2 Cache |
Chip lithography | 32 nm | 45 nm |
Die size | 131 mm2 | no data |
Maximum core temperature | 69 °C | 75 °C |
Number of transistors | 504 million | no data |
64 bit support | + | + |
Windows 11 compatibility | - | - |
VID voltage range | no data | 0.85V-1.35V |
Compatibility
Information on Core i3-2100 and Xeon L5215 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | 1 | no data |
Socket | FCLGA1155 | no data |
Power consumption (TDP) | 65 Watt | 20 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-2100 and Xeon L5215. You'll probably need this information if you require some particular technology.
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | no data |
Enhanced SpeedStep (EIST) | + | + |
Turbo Boost Technology | - | - |
Hyper-Threading Technology | + | - |
Idle States | + | + |
Thermal Monitoring | + | - |
Flex Memory Access | + | no data |
Demand Based Switching | no data | - |
FDI | + | no data |
Fast Memory Access | + | no data |
FSB parity | no data | + |
Security technologies
Core i3-2100 and Xeon L5215 technologies aimed at improving security, for example, by protecting against hacks.
TXT | + | - |
EDB | + | + |
Identity Protection | + | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-2100 and Xeon L5215 are enumerated here.
VT-d | - | no data |
VT-x | + | + |
EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-2100 and Xeon L5215. Depending on the motherboard, higher memory frequencies may be supported.
Supported memory types | DDR3 | no data |
Maximum memory size | 32 GB | no data |
Max memory channels | 2 | no data |
Maximum memory bandwidth | 21 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card | Intel HD Graphics 2000 | no data |
Quick Sync Video | + | - |
Clear Video HD | + | no data |
Graphics max frequency | 1.1 GHz | no data |
InTru 3D | + | no data |
Graphics interfaces
Available interfaces and connections of Core i3-2100 and Xeon L5215 integrated GPUs.
Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-2100 and Xeon L5215.
PCIe version | 2.0 | no data |
PCI Express lanes | 16 | no data |
Pros & cons summary
Recency | 20 February 2011 | 1 July 2008 |
Chip lithography | 32 nm | 45 nm |
Power consumption (TDP) | 65 Watt | 20 Watt |
i3-2100 has an age advantage of 2 years, and a 40.6% more advanced lithography process.
Xeon L5215, on the other hand, has 225% lower power consumption.
We couldn't decide between Core i3-2100 and Xeon L5215. We've got no test results to judge.
Note that Core i3-2100 is a desktop processor while Xeon L5215 is a server/workstation one.
Should you still have questions on choice between Core i3-2100 and Xeon L5215, ask them in Comments section, and we shall answer.
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