Sempron 3400+ EE SFF vs Duo T2350
Primary details
Comparing Core Duo T2350 and Sempron 3400+ EE SFF processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 3160 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Desktop processor |
| Series | Core Duo | no data |
| Power efficiency | 0.73 | no data |
| Architecture codename | Yonah (2005−2006) | Manila (2001−2006) |
| Release date | no data (2024 years ago) | May 2006 (18 years ago) |
Detailed specifications
Core Duo T2350 and Sempron 3400+ EE SFF basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 2 | 1 |
| Base clock speed | 1.86 GHz | no data |
| Boost clock speed | 1.86 GHz | 1.8 GHz |
| Bus rate | 533 MHz | no data |
| L1 cache | no data | 128 KB |
| L2 cache | no data | 256 KB |
| L3 cache | 2 MB L2 KB | 0 KB |
| Chip lithography | 65 nm | 90 nm |
| Die size | no data | 103 mm2 |
| Maximum core temperature | 100 °C | no data |
| Number of transistors | no data | 81 million |
| 64 bit support | - | + |
| Windows 11 compatibility | - | - |
| VID voltage range | 0.95V-1.262V | no data |
Compatibility
Information on Core Duo T2350 and Sempron 3400+ EE SFF compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 |
| Socket | PPGA478 | AM2 |
| Power consumption (TDP) | 31 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core Duo T2350 and Sempron 3400+ EE SFF. You'll probably need this information if you require some particular technology.
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Idle States | - | no data |
| Demand Based Switching | - | no data |
| FSB parity | - | no data |
Security technologies
Core Duo T2350 and Sempron 3400+ EE SFF technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core Duo T2350 and Sempron 3400+ EE SFF are enumerated here.
| VT-x | - | no data |
Pros & cons summary
| Physical cores | 2 | 1 |
| Threads | 2 | 1 |
| Chip lithography | 65 nm | 90 nm |
| Power consumption (TDP) | 31 Watt | 35 Watt |
Duo T2350 has 100% more physical cores and 100% more threads, a 38.5% more advanced lithography process, and 12.9% lower power consumption.
We couldn't decide between Core Duo T2350 and Sempron 3400+ EE SFF. We've got no test results to judge.
Be aware that Core Duo T2350 is a notebook processor while Sempron 3400+ EE SFF is a desktop one.
Should you still have questions on choice between Core Duo T2350 and Sempron 3400+ EE SFF, ask them in Comments section, and we shall answer.
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