Mobile Sempron 3300+ vs Core 2 Duo T5550

General info

Comparing Core 2 Duo T5550 and Mobile Sempron 3300+ processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	not rated	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Core 2 Duo	AMD Mobile Sempron
Architecture codename	Merom (2006−2008)	Roma (2005)
Release date	1 January 2008 (16 years old)	1 June 2005 (18 years old)
Current price	$144	$15

Technical specs

Core 2 Duo T5550 and Mobile Sempron 3300+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	2	1
Base clock speed	1.83 GHz	no data
Boost clock speed	1.83 GHz	2 GHz
Bus support	667 MHz	800 MHz
L2 cache	2 MB	128 KB
L3 cache	2 MB L2 Cache	no data
Chip lithography	65 nm	90 nm
Die size	143 mm2	no data
Maximum core temperature	100 °C	no data
Number of transistors	291 Million	no data
64 bit support	+	-
Windows 11 compatibility	-	-
Unlocked multiplier	No	No
VID voltage range	1.075V-1.25V	no data

Compatibility

Information on Core 2 Duo T5550 and Mobile Sempron 3300+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Socket	PPGA478	745
Power consumption (TDP)	35 Watt	62/25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core 2 Duo T5550 and Mobile Sempron 3300+. You'll probably need this information if you require some particular technology.

Instruction set extensions	no data	MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Demand Based Switching	-	no data
FSB parity	-	no data
Status	Discontinued	no data

Security technologies

Core 2 Duo T5550 and Mobile Sempron 3300+ technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core 2 Duo T5550 and Mobile Sempron 3300+ are enumerated here.

VT-x

-

no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Advantages and disadvantages

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Recency	1 January 2008	1 June 2005
Physical cores	2	1
Threads	2	1
Chip lithography	65 nm	90 nm
Power consumption (TDP)	35 Watt	62 Watt

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Should you still have questions on choice between Core 2 Duo T5550 and Mobile Sempron 3300+, ask them in Comments section, and we shall answer.

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