Duo T2300 vs C-70
Aggregate performance score
Primary details
Comparing C-70 and Core Duo T2300 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 3236 | 3230 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD C-Series | Core Duo |
| Power efficiency | 2.10 | 0.61 |
| Architecture codename | Ontario (2011−2012) | Yonah (2005−2006) |
| Release date | 1 September 2012 (12 years ago) | January 2006 (18 years ago) |
Detailed specifications
C-70 and Core Duo T2300 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 2 (Dual-core) |
| Threads | 2 | 2 |
| Base clock speed | 1 GHz | 1.66 GHz |
| Boost clock speed | 1.33 GHz | 1.66 GHz |
| Bus rate | no data | 667 MHz |
| L1 cache | 64K (per core) | 0 KB |
| L2 cache | 512K (per core) | 2 MB |
| L3 cache | 0 KB | 0 KB |
| Chip lithography | 40 nm | 65 nm |
| Die size | 75 mm2 | 90 mm2 |
| Maximum core temperature | no data | 100 °C |
| Number of transistors | no data | 151 million |
| 64 bit support | + | - |
| Windows 11 compatibility | - | - |
| VID voltage range | no data | 1.1625V - 1.3V |
Compatibility
Information on C-70 and Core Duo T2300 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FT1 BGA 413-Ball | PPGA478, PBGA479 |
| Power consumption (TDP) | 9 Watt | 31 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by C-70 and Core Duo T2300. You'll probably need this information if you require some particular technology.
| Instruction set extensions | MMX(+), SSE(1,2,3,3S,4A), AMD-V, Radeon HD 6290 (276-400 MHz) | no data |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | - |
| Idle States | no data | - |
| Demand Based Switching | no data | - |
| PAE | no data | 32 Bit |
| FSB parity | no data | - |
Security technologies
C-70 and Core Duo T2300 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by C-70 and Core Duo T2300 are enumerated here.
| AMD-V | + | - |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by C-70 and Core Duo T2300. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 Single-channel | DDR1 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon HD 6290 (280 - 400 MHz) | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Pros & cons summary
| Chip lithography | 40 nm | 65 nm |
| Power consumption (TDP) | 9 Watt | 31 Watt |
C-70 has a 62.5% more advanced lithography process, and 244.4% lower power consumption.
Given the minimal performance differences, no clear winner can be declared between C-70 and Core Duo T2300.
Should you still have questions on choice between C-70 and Core Duo T2300, ask them in Comments section, and we shall answer.
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