Xeon E7-8860 v3: specs and benchmarks

Summary

Intel started Xeon E7-8860 v3 sales 1 June 2015. This is a Haswell-EX architecture desktop processor primarily aimed at professional systems. It has 16 cores and 32 threads, and is based on 22 nm manufacturing technology, with a maximum frequency of 3200 MHz and a locked multiplier.

Compatibility-wise, this is FCLGA2011 processor with a TDP of 140 Watt and a maximum temperature of 75 °C. It supports DDR4-1333/1600/1866, DDR3-1066/1333/1600 memory.

Primary details

Xeon E7-8860 v3 processor market type (desktop or notebook), architecture, sales start time and pricing.

Place in the ranking	not rated
Place by popularity	not in top-100
Market segment	Server
Architecture codename	Haswell-EX (2015)
Release date	1 June 2015 (9 years ago)

Detailed specifications

Basic microprocessor parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters can generally indicate CPU performance, but to be more precise you have to review its test results.

Physical cores	16 (Hexadeca-Core)
Threads	32
Base clock speed	2.2 GHz	of 4.7 GHz (FX-9590)
Boost clock speed	3.2 GHz	of 6.2 GHz (Core i9-14900KS)
Bus rate	9.6 GT/s
L1 cache	64K (per core)	of 80 KB (EPYC 9965)
L2 cache	256K (per core)
L3 cache	40 MB (shared)	of 1152 MB (EPYC 9684X)
Chip lithography	22 nm	of 3 nm (Apple M3 Max 16-Core)
Die size	160 mm2
Maximum case temperature (TCase)	75 °C	of 105 °C (Core i7-5950HQ)
Number of transistors	1,400 million	of 135,240 million (EPYC 9684X)
64 bit support	+
Windows 11 compatibility	-

Compatibility

Information on Xeon E7-8860 v3 compatibility with other computer components and devices: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	8
Socket	FCLGA2011
Power consumption (TDP)	140 Watt	of 3100 ‑ 4500 (Ryzen 7 7435H)

Technologies and extensions

Technological capabilities and additional instructions supported by Xeon E7-8860 v3. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX2
AES-NI	+
AVX	+
vPro	+
Enhanced SpeedStep (EIST)	+
Turbo Boost Technology	2.0
Hyper-Threading Technology	+
TSX	+
Idle States	+
Thermal Monitoring	+
PAE	46 Bit

Security technologies

Processor technologies aimed at improving security, for example, by protecting against hacks.

TXT	+
EDB	+
Secure Key	+
OS Guard	+

Virtualization technologies

Supported virtual machine optimization technologies. Some are specific to Intel only, some to AMD.

VT-d	+
VT-x	+
EPT	+

Memory specs

Types, maximum amount and channel number of RAM supported by Xeon E7-8860 v3's memory controller. Depending on the motherboard, higher memory frequency may be supported.

Supported memory types	DDR4-1333/1600/1866, DDR3-1066/1333/1600
Maximum memory size	1.5 TB	of 6 TiB (EPYC 9124)
Max memory channels	4	of 12 (Xeon Platinum 9221)
Maximum memory bandwidth	85 GB/s	of 460.8 GB/s (EPYC 9124)
ECC memory support	+

Peripherals

Specifications and connection types of supported peripherals.

PCIe version	3.0	of 5.0 (Core i9-12900K)
PCI Express lanes	32	of 128 (EPYC 7551P)

Benchmark performance

Single-core and multi-core benchmark results of Xeon E7-8860 v3. Overall benchmark performance is measured in points in 0-100 range, higher is better.

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