Ryzen AI 9 HX PRO 370 vs Xeon E3-1230 v3
Aggregate performance score
Ryzen AI 9 HX PRO 370 outperforms Xeon E3-1230 v3 by a whopping 381% based on our aggregate benchmark results.
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1609 | 371 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 0.96 | no data |
| Market segment | Server | Laptop |
| Series | Xeon (Desktop) | Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | 5.20 | 71.42 |
| Designer | Intel | AMD |
| Manufacturer | Intel | TSMC |
| Architecture codename | Haswell-WS (2013−2014) | Strix Point-HX PRO (Zen 5/5c) (2025) |
| Release date | 2 June 2013 (12 years ago) | 6 January 2025 (less than a year ago) |
| Launch price (MSRP) | $240 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 12 (Dodeca-Core) |
| Threads | 8 | 24 |
| Base clock speed | 3.3 GHz | 2 GHz |
| Boost clock speed | 3.7 GHz | 5.1 GHz |
| Bus rate | 5 GT/s | 54 MHz |
| L1 cache | 64 KB (per core) | 80 KB (per core) |
| L2 cache | 256K (per core) | 1 MB (per core) |
| L3 cache | 8 MB (shared) | 16 MB |
| Chip lithography | 22 nm | 4 nm |
| Die size | 160 mm2 | 233 mm2 |
| Number of transistors | 1,400 million | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | - | no data |
Compatibility
Information on Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FCLGA1150 | FP8 |
| Power consumption (TDP) | 80 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX+, SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | + | + |
| AVX | + | + |
| vPro | + | no data |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| SIPP | + | - |
| Fast Memory Access | + | no data |
| Precision Boost 2 | no data | + |
Security technologies
Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Identity Protection | + | - |
| OS Guard | + | no data |
| Anti-Theft | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370 are enumerated here.
| AMD-V | + | + |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | DDR5 |
| Maximum memory size | 32 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 25.6 GB/s | no data |
| ECC memory support | + | - |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon 890M ( - 2900 MHz) |
Peripherals
Specifications and connection of peripherals supported by Xeon E3-1230 v3 and Ryzen AI 9 HX PRO 370.
| PCIe version | 3.0 | 4.0 |
| PCI Express lanes | 16 | 16 |
Synthetic benchmarks
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance. Other than that, Passmark measures multi-core performance.
Cinebench 10 32-bit single-core
Cinebench R10 is an ancient ray tracing benchmark for processors by Maxon, authors of Cinema 4D. Its single core version uses just one CPU thread to render a futuristic looking motorcycle.
Cinebench 10 32-bit multi-core
Cinebench Release 10 Multi Core is a variant of Cinebench R10 using all the processor threads. Possible number of threads is limited by 16 in this version.
Cinebench 15 64-bit multi-core
Cinebench Release 15 Multi Core is a variant of Cinebench R15 which uses all the processor threads.
Cinebench 15 64-bit single-core
Cinebench R15 (standing for Release 15) is a benchmark made by Maxon, authors of Cinema 4D. It was superseded by later versions of Cinebench, which use more modern variants of Cinema 4D engine. The Single Core version (sometimes called Single-Thread) only uses a single processor thread to render a room full of reflective spheres and light sources.
Pros & cons summary
| Performance score | 3.87 | 18.62 |
| Recency | 2 June 2013 | 6 January 2025 |
| Physical cores | 4 | 12 |
| Threads | 8 | 24 |
| Chip lithography | 22 nm | 4 nm |
| Power consumption (TDP) | 80 Watt | 28 Watt |
Ryzen AI 9 HX PRO 370 has a 381.1% higher aggregate performance score, an age advantage of 11 years, 200% more physical cores and 200% more threads, a 450% more advanced lithography process, and 185.7% lower power consumption.
The AMD Ryzen AI 9 HX PRO 370 is our recommended choice as it beats the Intel Xeon E3-1230 v3 in performance tests.
Be aware that Xeon E3-1230 v3 is a server/workstation processor while Ryzen AI 9 HX PRO 370 is a notebook one.
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