Ryzen AI 9 HX 170 vs Xeon E3-1230 v3
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1581 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 0.95 | no data |
| Market segment | Server | Laptop |
| Series | Xeon (Desktop) | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | 2.05 | no data |
| Designer | Intel | AMD |
| Manufacturer | Intel | no data |
| Architecture codename | Haswell-WS (2013−2014) | Strix Point-HX (Zen 5) (2024) |
| Release date | 2 June 2013 (12 years ago) | 4 June 2024 (1 year ago) |
| Launch price (MSRP) | $240 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
Xeon E3-1230 v3 and Ryzen AI 9 HX 170 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 12 (Dodeca-Core) |
| Threads | 8 | 24 |
| Base clock speed | 3.3 GHz | no data |
| Boost clock speed | 3.7 GHz | 5.1 GHz |
| Bus rate | 5 GT/s | no data |
| L1 cache | 64 KB (per core) | no data |
| L2 cache | 256K (per core) | no data |
| L3 cache | 8 MB (shared) | 36 MB |
| Chip lithography | 22 nm | 3 nm |
| Die size | 160 mm2 | no data |
| Number of transistors | 1,400 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | no data |
Compatibility
Information on Xeon E3-1230 v3 and Ryzen AI 9 HX 170 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | FCLGA1150 | no data |
| Power consumption (TDP) | 80 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon E3-1230 v3 and Ryzen AI 9 HX 170. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | XDNA 2 NPU |
| AES-NI | + | - |
| AVX | + | - |
| vPro | + | no data |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| SIPP | + | - |
| Fast Memory Access | + | no data |
Security technologies
Xeon E3-1230 v3 and Ryzen AI 9 HX 170 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Identity Protection | + | - |
| OS Guard | + | no data |
| Anti-Theft | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon E3-1230 v3 and Ryzen AI 9 HX 170 are enumerated here.
| AMD-V | + | - |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon E3-1230 v3 and Ryzen AI 9 HX 170. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 32 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 25.6 GB/s | no data |
| ECC memory support | + | - |
Peripherals
Specifications and connection of peripherals supported by Xeon E3-1230 v3 and Ryzen AI 9 HX 170.
| PCIe version | 3.0 | no data |
| PCI Express lanes | 16 | no data |
Pros & cons summary
| Recency | 2 June 2013 | 4 June 2024 |
| Physical cores | 4 | 12 |
| Threads | 8 | 24 |
| Chip lithography | 22 nm | 3 nm |
| Power consumption (TDP) | 80 Watt | 55 Watt |
Ryzen AI 9 HX 170 has an age advantage of 11 years, 200% more physical cores and 200% more threads, a 633.3% more advanced lithography process, and 45.5% lower power consumption.
We couldn't decide between Intel Xeon E3-1230 v3 and AMD Ryzen AI 9 HX 170. We've got no test results to judge.
Be aware that Xeon E3-1230 v3 is a server/workstation processor while Ryzen AI 9 HX 170 is a notebook one.
Other comparisons
We've compiled a selection of CPU comparisons, ranging from closely matched processors to other comparisons that may be of interest.
