Ryzen 9 7900X3D vs Sempron 2650
Primary details
Comparing Sempron 2650 and Ryzen 9 7900X3D processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 127 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 49.12 |
| Market segment | Desktop processor | Desktop processor |
| Series | no data | AMD Ryzen 9 |
| Power efficiency | no data | 25.03 |
| Architecture codename | Kabini (2013−2014) | Raphael (2023−2024) |
| Release date | 9 April 2014 (10 years ago) | 4 January 2023 (1 year ago) |
| Launch price (MSRP) | no data | $599 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Sempron 2650 and Ryzen 9 7900X3D basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 12 (Dodeca-Core) |
| Threads | 2 | 24 |
| Base clock speed | no data | 4.4 GHz |
| Boost clock speed | 1.45 GHz | 5.6 GHz |
| L1 cache | 128 KB | 768 KB |
| L2 cache | 1024 KB | 12 MB |
| L3 cache | no data | 128 MB (shared) |
| Chip lithography | 28 nm | 5 nm, 6 nm |
| Die size | 107 mm2 | 71+71+122 mm |
| Maximum core temperature | 90 °C | no data |
| Maximum case temperature (TCase) | 90 °C | 47 °C |
| Number of transistors | no data | 13,140 million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | + |
| Unlocked multiplier | - | + |
Compatibility
Information on Sempron 2650 and Ryzen 9 7900X3D compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | AM1 | AM5 |
| Power consumption (TDP) | 25 Watt | 120 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Sempron 2650 and Ryzen 9 7900X3D. You'll probably need this information if you require some particular technology.
| AES-NI | + | + |
| FMA | FMA4 | - |
| AVX | + | + |
| PowerNow | + | - |
| PowerGating | + | - |
| VirusProtect | + | - |
| Precision Boost 2 | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Sempron 2650 and Ryzen 9 7900X3D are enumerated here.
| AMD-V | + | + |
| IOMMU 2.0 | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Sempron 2650 and Ryzen 9 7900X3D. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3-1333 | DDR5-5200 |
| Maximum memory size | no data | 128 GB |
| Max memory channels | 1 | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | AMD Radeon R3 Graphics | AMD Radeon Graphics |
| Number of pipelines | 128 | no data |
| Enduro | + | - |
| Switchable graphics | + | - |
| UVD | + | - |
| VCE | + | - |
Graphics interfaces
Available interfaces and connections of Sempron 2650 and Ryzen 9 7900X3D integrated GPUs.
| DisplayPort | + | - |
| HDMI | + | - |
Graphics API support
APIs supported by Sempron 2650 and Ryzen 9 7900X3D integrated GPUs, sometimes API versions are included.
| DirectX | DirectX® 12 | no data |
| Vulkan | + | - |
Peripherals
Specifications and connection of peripherals supported by Sempron 2650 and Ryzen 9 7900X3D.
| PCIe version | 2.0 | 5.0 |
| PCI Express lanes | 4 | 24 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Pros & cons summary
| Recency | 9 April 2014 | 4 January 2023 |
| Physical cores | 2 | 12 |
| Threads | 2 | 24 |
| Chip lithography | 28 nm | 5 nm |
| Power consumption (TDP) | 25 Watt | 120 Watt |
Sempron 2650 has 380% lower power consumption.
Ryzen 9 7900X3D, on the other hand, has an age advantage of 8 years, 500% more physical cores and 1100% more threads, and a 460% more advanced lithography process.
We couldn't decide between Sempron 2650 and Ryzen 9 7900X3D. We've got no test results to judge.
Should you still have questions on choice between Sempron 2650 and Ryzen 9 7900X3D, ask them in Comments section, and we shall answer.
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