Xeon W-2170B vs Ryzen AI 9 HX 375
Aggregate performance score
Ryzen AI 9 HX 375 outperforms Xeon W-2170B by a significant 28% based on our aggregate benchmark results.
Primary details
Comparing Ryzen AI 9 HX 375 and Xeon W-2170B processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 288 | 458 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Server |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | Intel Xeon W |
| Power efficiency | 34.07 | 10.23 |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Skylake (server) (2017−2018) |
| Release date | 25 July 2024 (less than a year ago) | 21 December 2017 (6 years ago) |
Detailed specifications
Ryzen AI 9 HX 375 and Xeon W-2170B basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 14 (Tetradeca-Core) |
| Threads | 24 | 28 |
| Base clock speed | 2 GHz | 2.5 GHz |
| Boost clock speed | 5.1 GHz | 4.3 GHz |
| Bus type | no data | DMI 3.0 |
| Bus rate | no data | 4 × 8 GT/s |
| Multiplier | no data | 25 |
| L1 cache | no data | 64K (per core) |
| L2 cache | 12 MB | 1 MB (per core) |
| L3 cache | 24 MB | 19.25 MB (shared) |
| Chip lithography | 4 nm | 14 nm |
| Die size | no data | 484 mm2 |
| Maximum core temperature | 100 °C | no data |
| Maximum case temperature (TCase) | no data | 66 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Xeon W-2170B compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | FP8 | 2066 |
| Power consumption (TDP) | 54 Watt | 140 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Xeon W-2170B. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | + |
| AVX | + | + |
| vPro | no data | + |
| Enhanced SpeedStep (EIST) | no data | + |
| TSX | - | + |
Security technologies
Ryzen AI 9 HX 375 and Xeon W-2170B technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 375 and Xeon W-2170B are enumerated here.
| VT-d | no data | + |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Xeon W-2170B. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4-2666 |
| Maximum memory size | no data | 512 GB |
| Max memory channels | no data | 4 |
| Maximum memory bandwidth | no data | 85.33 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M ( - 2900 MHz) | no data |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 375 and Xeon W-2170B.
| PCIe version | no data | 3.0 |
| PCI Express lanes | no data | 48 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 19.44 | 15.14 |
| Recency | 25 July 2024 | 21 December 2017 |
| Physical cores | 12 | 14 |
| Threads | 24 | 28 |
| Chip lithography | 4 nm | 14 nm |
| Power consumption (TDP) | 54 Watt | 140 Watt |
Ryzen AI 9 HX 375 has a 28.4% higher aggregate performance score, an age advantage of 6 years, a 250% more advanced lithography process, and 159.3% lower power consumption.
Xeon W-2170B, on the other hand, has 16.7% more physical cores and 16.7% more threads.
The Ryzen AI 9 HX 375 is our recommended choice as it beats the Xeon W-2170B in performance tests.
Be aware that Ryzen AI 9 HX 375 is a notebook processor while Xeon W-2170B is a server/workstation one.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Xeon W-2170B, ask them in Comments section, and we shall answer.
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