i3-2308M vs Ryzen AI 9 HX 375
Primary details
Comparing Ryzen AI 9 HX 375 and Core i3-2308M processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 302 | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Laptop | Laptop |
Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | Intel Core i3 |
Power efficiency | 33.40 | no data |
Architecture codename | Strix Point-HX (Zen 5) (2024) | Sandy Bridge (2011−2013) |
Release date | 25 July 2024 (less than a year ago) | 20 February 2011 (13 years ago) |
Detailed specifications
Ryzen AI 9 HX 375 and Core i3-2308M basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
Threads | 24 | 4 |
Base clock speed | 2 GHz | no data |
Boost clock speed | 5.1 GHz | 2.1 GHz |
Bus type | no data | DMI 2.0 |
Bus rate | no data | 4 × 5 GT/s |
Multiplier | no data | 21 |
L1 cache | no data | 128 KB |
L2 cache | 12 MB | 512 KB |
L3 cache | 24 MB | 3 MB |
Chip lithography | 4 nm | 32 nm |
Die size | no data | 149 mm2 |
Maximum core temperature | 100 °C | 85 (PGA); 100(BGA) °C |
Number of transistors | no data | 624 Million |
64 bit support | + | + |
Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Core i3-2308M compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
Socket | FP8 | rPGA988B / BGA1023 |
Power consumption (TDP) | 54 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Core i3-2308M. You'll probably need this information if you require some particular technology.
Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
AES-NI | + | - |
FMA | - | + |
AVX | + | + |
Enhanced SpeedStep (EIST) | no data | + |
Hyper-Threading Technology | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 375 and Core i3-2308M are enumerated here.
AMD-V | - | + |
VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Core i3-2308M. Depending on the motherboard, higher memory frequencies may be supported.
Supported memory types | DDR5 | DDR3 |
Maximum memory size | no data | 16 GB |
Max memory channels | no data | 2 |
Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card Compare | AMD Radeon 890M | Intel HD Graphics 3000 |
Pros & cons summary
Integrated graphics card | 21.70 | 0.66 |
Recency | 25 July 2024 | 20 February 2011 |
Physical cores | 12 | 2 |
Threads | 24 | 4 |
Chip lithography | 4 nm | 32 nm |
Power consumption (TDP) | 54 Watt | 35 Watt |
Ryzen AI 9 HX 375 has 3187.9% faster integrated GPU, an age advantage of 13 years, 500% more physical cores and 500% more threads, and a 700% more advanced lithography process.
i3-2308M, on the other hand, has 54.3% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 375 and Core i3-2308M. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Core i3-2308M, ask them in Comments section, and we shall answer.
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