VIA C3-M C3-M-1500 vs i3-2308M
Primary details
Comparing Core i3-2308M and VIA C3-M C3-M-1500 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Intel Core i3 | C3-M |
| Architecture codename | Sandy Bridge (2011−2013) | Nehemiah |
| Release date | 20 February 2011 (13 years ago) | no data (2024 years ago) |
Detailed specifications
Core i3-2308M and VIA C3-M C3-M-1500 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 4 | 1 |
| Boost clock speed | 2.1 GHz | 1.5 GHz |
| Bus type | DMI 2.0 | no data |
| Bus rate | 4 × 5 GT/s | 200 MHz |
| Multiplier | 21 | no data |
| L1 cache | 128 KB | no data |
| L2 cache | 512 KB | no data |
| L3 cache | 3 MB | no data |
| Chip lithography | 32 nm | 130 nm |
| Die size | 149 mm2 | no data |
| Maximum core temperature | 85 (PGA); 100(BGA) °C | no data |
| Number of transistors | 624 Million | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | - | - |
Compatibility
Information on Core i3-2308M and VIA C3-M C3-M-1500 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | no data |
| Socket | rPGA988B / BGA1023 | no data |
| Power consumption (TDP) | 35 Watt | 12 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-2308M and VIA C3-M C3-M-1500. You'll probably need this information if you require some particular technology.
| FMA | + | - |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | + | no data |
| Hyper-Threading Technology | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-2308M and VIA C3-M C3-M-1500 are enumerated here.
| AMD-V | + | - |
| VT-x | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-2308M and VIA C3-M C3-M-1500. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 16 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 21.335 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD Graphics 3000 | no data |
Pros & cons summary
| Physical cores | 2 | 1 |
| Threads | 4 | 1 |
| Chip lithography | 32 nm | 130 nm |
| Power consumption (TDP) | 35 Watt | 12 Watt |
i3-2308M has 100% more physical cores and 300% more threads, and a 306.3% more advanced lithography process.
VIA C3-M C3-M-1500, on the other hand, has 191.7% lower power consumption.
We couldn't decide between Core i3-2308M and VIA C3-M C3-M-1500. We've got no test results to judge.
Should you still have questions on choice between Core i3-2308M and VIA C3-M C3-M-1500, ask them in Comments section, and we shall answer.
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