Celeron 857 vs Ryzen AI 9 HX 375
Primary details
Comparing Ryzen AI 9 HX 375 and Celeron 857 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 232 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | Intel Celeron |
| Power efficiency | 38.25 | no data |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Sandy Bridge (2011−2013) |
| Release date | 25 July 2024 (less than a year ago) | 1 July 2011 (13 years ago) |
| Launch price (MSRP) | no data | $134 |
Detailed specifications
Ryzen AI 9 HX 375 and Celeron 857 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
| Threads | 24 | 2 |
| Base clock speed | 2 GHz | 1.2 GHz |
| Boost clock speed | 5.1 GHz | 1.2 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | no data | 4 × 5 GT/s |
| Multiplier | no data | 12 |
| L1 cache | no data | 64K (per core) |
| L2 cache | 12 MB | 256K (per core) |
| L3 cache | 24 MB | 2 MB (shared) |
| Chip lithography | 4 nm | 32 nm |
| Die size | no data | 131 mm2 |
| Maximum core temperature | 100 °C | 100 °C |
| Number of transistors | no data | 504 million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Celeron 857 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | FP8 | FCBGA1023 |
| Power consumption (TDP) | 54 Watt | 17 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Celeron 857. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | Intel® SSE4.1, Intel® SSE4.2 |
| AES-NI | + | - |
| FMA | - | + |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| My WiFi | no data | - |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | - |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | + |
| Demand Based Switching | no data | - |
| FDI | no data | + |
| Fast Memory Access | no data | + |
Security technologies
Ryzen AI 9 HX 375 and Celeron 857 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
| Anti-Theft | no data | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 375 and Celeron 857 are enumerated here.
| VT-d | no data | - |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Celeron 857. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR3 |
| Maximum memory size | no data | 16 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | Intel® HD Graphics for 2nd Generation Intel® Processors |
| Graphics max frequency | no data | 1 GHz |
Graphics interfaces
Available interfaces and connections of Ryzen AI 9 HX 375 and Celeron 857 integrated GPUs.
| Number of displays supported | no data | 2 |
| eDP | no data | + |
| DisplayPort | - | + |
| HDMI | - | + |
| SDVO | no data | + |
| CRT | no data | + |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 375 and Celeron 857.
| PCIe version | no data | 2.0 |
| PCI Express lanes | no data | 16 |
Pros & cons summary
| Recency | 25 July 2024 | 1 July 2011 |
| Physical cores | 12 | 2 |
| Threads | 24 | 2 |
| Chip lithography | 4 nm | 32 nm |
| Power consumption (TDP) | 54 Watt | 17 Watt |
Ryzen AI 9 HX 375 has an age advantage of 13 years, 500% more physical cores and 1100% more threads, and a 700% more advanced lithography process.
Celeron 857, on the other hand, has 217.6% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 375 and Celeron 857. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Celeron 857, ask them in Comments section, and we shall answer.
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