m3-8114Y vs Ryzen AI 9 HX 370
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 256 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Power efficiency | 74.50 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | Intel |
| Architecture codename | Strix Point (2024−2025) | Cannon Lake-Y (2018) |
| Release date | July 2024 (recently) | 5 May 2018 (6 years ago) |
Detailed specifications
Ryzen AI 9 HX 370 and Core m3-8114Y basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
| Threads | 24 | 4 |
| Base clock speed | 2 GHz | no data |
| Boost clock speed | 5.1 GHz | 1.5 GHz |
| Bus rate | 54 MHz | no data |
| L1 cache | 80 KB (per core) | 64 KB (per core) |
| L2 cache | 1 MB (per core) | 256 KB (per core) |
| L3 cache | 24 MB (shared) | 4 MB (shared) |
| Chip lithography | 4 nm | 10 nm |
| Die size | 233 mm2 | 123 mm2 |
| Maximum core temperature | 100 °C | no data |
| Maximum case temperature (TCase) | no data | 72 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 370 and Core m3-8114Y compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FP8 | Intel BGA1440 |
| Power consumption (TDP) | 28 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 370 and Core m3-8114Y. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | no data | + |
| TSX | - | + |
| Precision Boost 2 | + | no data |
Security technologies
Ryzen AI 9 HX 370 and Core m3-8114Y technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 370 and Core m3-8114Y are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 370 and Core m3-8114Y. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | Iris Pro Plus |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 370 and Core m3-8114Y.
| PCIe version | 4.0 | no data |
| PCI Express lanes | 16 | no data |
Pros & cons summary
| Physical cores | 12 | 2 |
| Threads | 24 | 4 |
| Chip lithography | 4 nm | 10 nm |
Ryzen AI 9 HX 370 has 500% more physical cores and 500% more threads, and a 150% more advanced lithography process.
We couldn't decide between AMD Ryzen AI 9 HX 370 and Intel Core m3-8114Y. We've got no test results to judge.
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