i3-3217U vs Mobile Sempron 210U
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 2915 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 0.03 |
| Market segment | Laptop | Laptop |
| Series | AMD Mobile Sempron | Intel Core i3 |
| Power efficiency | no data | 1.75 |
| Designer | AMD | Intel |
| Manufacturer | no data | Intel |
| Architecture codename | no data | Ivy Bridge (2012−2013) |
| Release date | 16 January 2009 (16 years ago) | 1 June 2012 (13 years ago) |
| Launch price (MSRP) | no data | $225 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
Mobile Sempron 210U and Core i3-3217U basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 2 (Dual-core) |
| Threads | 1 | 4 |
| Base clock speed | no data | 1.8 GHz |
| Boost clock speed | 1.5 GHz | 1.8 GHz |
| Bus rate | 1600 MHz | 5 GT/s |
| L1 cache | 128 KB | 64K (per core) |
| L2 cache | 256 KB | 256K (per core) |
| L3 cache | no data | 3 MB (shared) |
| Chip lithography | 65 nm | 22 nm |
| Die size | no data | 118 mm2 |
| Maximum core temperature | no data | 105 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on Mobile Sempron 210U and Core i3-3217U compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 |
| Socket | 812-ball BGA | FCBGA1023 |
| Power consumption (TDP) | 15 Watt | 17 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Mobile Sempron 210U and Core i3-3217U. You'll probably need this information if you require some particular technology.
| Instruction set extensions | AMD64, SSE1-3, MMX | Intel® AVX |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | no data | + |
| My WiFi | no data | + |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | + |
| Demand Based Switching | no data | - |
| FDI | no data | + |
| Fast Memory Access | no data | + |
Security technologies
Mobile Sempron 210U and Core i3-3217U technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
| Identity Protection | - | + |
| Anti-Theft | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Mobile Sempron 210U and Core i3-3217U are enumerated here.
| VT-d | no data | - |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Mobile Sempron 210U and Core i3-3217U. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR2 | DDR3/L/-RS 1333/1600 |
| Maximum memory size | no data | 32 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 25.6 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | Intel HD Graphics 4000 |
| Quick Sync Video | - | + |
| Clear Video HD | no data | + |
| Graphics max frequency | no data | 1.05 GHz |
| InTru 3D | no data | + |
Graphics interfaces
Available interfaces and connections of Mobile Sempron 210U and Core i3-3217U integrated GPUs.
| Number of displays supported | no data | 3 |
| eDP | no data | + |
| DisplayPort | - | + |
| HDMI | - | + |
| SDVO | no data | + |
| CRT | no data | + |
Peripherals
Specifications and connection of peripherals supported by Mobile Sempron 210U and Core i3-3217U.
| PCIe version | no data | 2.0 |
| PCI Express lanes | no data | 16 |
Synthetic benchmarks
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Cinebench 10 32-bit single-core
Cinebench R10 is an ancient ray tracing benchmark for processors by Maxon, authors of Cinema 4D. Its single core version uses just one CPU thread to render a futuristic looking motorcycle.
Pros & cons summary
| Recency | 16 January 2009 | 1 June 2012 |
| Physical cores | 1 | 2 |
| Threads | 1 | 4 |
| Chip lithography | 65 nm | 22 nm |
| Power consumption (TDP) | 15 Watt | 17 Watt |
Mobile Sempron 210U has 13.3% lower power consumption.
i3-3217U, on the other hand, has an age advantage of 3 years, 100% more physical cores and 300% more threads, and a 195.5% more advanced lithography process.
We couldn't decide between AMD Mobile Sempron 210U and Intel Core i3-3217U. We've got no test results to judge.
Other comparisons
We've compiled a selection of CPU comparisons, ranging from closely matched processors to other comparisons that may be of interest.
