Ryzen Embedded V2516 vs i3-9000
Primary details
Comparing Core i3-9000 and Ryzen Embedded V2516 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 920 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Desktop processor | Desktop processor |
| Series | Intel Core i3 | AMD Ryzen Embedded |
| Power efficiency | no data | 77.51 |
| Architecture codename | Coffee Lake (2017−2019) | Renoir (2020−2023) |
| Release date | 1 September 2018 (6 years ago) | 10 November 2020 (4 years ago) |
Detailed specifications
Core i3-9000 and Ryzen Embedded V2516 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 6 (Hexa-Core) |
| Threads | 4 | 12 |
| Base clock speed | 3.7 GHz | 2.1 GHz |
| Boost clock speed | 3.7 GHz | 3.95 GHz |
| Bus type | DMI 3.0 | no data |
| Bus rate | 4 × 8 GT/s | no data |
| Multiplier | 37 | 21 |
| L1 cache | 64K (per core) | 64K (per core) |
| L2 cache | 256K (per core) | 512K (per core) |
| L3 cache | 6 MB (shared) | 8 MB (shared) |
| Chip lithography | 14 nm | 7 nm |
| Die size | 126 mm2 | 156 mm2 |
| Maximum case temperature (TCase) | 72 °C | no data |
| Number of transistors | no data | 9,800 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | + |
Compatibility
Information on Core i3-9000 and Ryzen Embedded V2516 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 |
| Socket | 1151 | FP6 |
| Power consumption (TDP) | 65 Watt | 10 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-9000 and Ryzen Embedded V2516. You'll probably need this information if you require some particular technology.
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-9000 and Ryzen Embedded V2516 are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-9000 and Ryzen Embedded V2516. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4 Dual-channel | DDR4-3200 |
| Maximum memory size | 64 GB | 64 GB |
| Max memory channels | 2 | 4 |
| Maximum memory bandwidth | 38.397 GB/s | 68.269 GB/s |
| ECC memory support | + | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | Intel UHD Graphics 630 | AMD Radeon Graphics 384SP |
Peripherals
Specifications and connection of peripherals supported by Core i3-9000 and Ryzen Embedded V2516.
| PCIe version | 3.0 | 3.0 |
| PCI Express lanes | no data | 20 |
Pros & cons summary
| Recency | 1 September 2018 | 10 November 2020 |
| Physical cores | 4 | 6 |
| Threads | 4 | 12 |
| Chip lithography | 14 nm | 7 nm |
| Power consumption (TDP) | 65 Watt | 10 Watt |
Ryzen Embedded V2516 has an age advantage of 2 years, 50% more physical cores and 200% more threads, a 100% more advanced lithography process, and 550% lower power consumption.
We couldn't decide between Core i3-9000 and Ryzen Embedded V2516. We've got no test results to judge.
Should you still have questions on choice between Core i3-9000 and Ryzen Embedded V2516, ask them in Comments section, and we shall answer.
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