Xeon Platinum 8170 vs i3-370M
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2993 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 0.03 | no data |
| Market segment | Laptop | Server |
| Series | Intel Core i3 | Intel Xeon Platinum |
| Power efficiency | 0.81 | no data |
| Designer | Intel | Intel |
| Manufacturer | Intel | no data |
| Architecture codename | Arrandale (2010−2011) | Skylake (server) (2017−2018) |
| Release date | 20 June 2010 (15 years ago) | 25 April 2017 (8 years ago) |
| Launch price (MSRP) | $245 | $7,405 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
Core i3-370M and Xeon Platinum 8170 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 26 (Hexacosa-Core) |
| Threads | 4 | 52 |
| Base clock speed | 2.4 GHz | 2.1 GHz |
| Boost clock speed | 2.4 GHz | 3.7 GHz |
| Bus type | DMI 1.0 | no data |
| Bus rate | 1 × 2.5 GT/s | no data |
| Multiplier | 18 | 21 |
| L1 cache | 64K (per core) | 1.625 MB |
| L2 cache | 256K (per core) | 26 MB |
| L3 cache | 3 MB (shared) | 35.75 MB |
| Chip lithography | 32 nm | 14 nm |
| Die size | 81+114 mm2 | no data |
| Maximum core temperature | 90 °C for rPGA, 105 °C for BGA | 89 °C |
| Number of transistors | 382+177 Million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | + |
Compatibility
Information on Core i3-370M and Xeon Platinum 8170 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 8 (Multiprocessor) |
| Socket | PGA988 | FCLGA3647 |
| Power consumption (TDP) | 35 Watt | 165 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-370M and Xeon Platinum 8170. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 |
| AES-NI | - | + |
| FMA | + | - |
| AVX | - | + |
| vPro | no data | + |
| Enhanced SpeedStep (EIST) | + | + |
| Speed Shift | no data | + |
| Turbo Boost Technology | - | 2.0 |
| Hyper-Threading Technology | + | + |
| TSX | - | + |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| PAE | 36 Bit | no data |
| Turbo Boost Max 3.0 | no data | - |
| FDI | + | no data |
| Fast Memory Access | + | no data |
Security technologies
Core i3-370M and Xeon Platinum 8170 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | + |
| EDB | + | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-370M and Xeon Platinum 8170 are enumerated here.
| VT-d | - | + |
| VT-x | + | + |
| EPT | + | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-370M and Xeon Platinum 8170. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | DDR4-2666 |
| Maximum memory size | 8 GB | 768 GB |
| Max memory channels | 2 | 6 |
| Maximum memory bandwidth | 17.051 GB/s | 128.001 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD Graphics for Previous Generation Intel Processors | no data |
| Clear Video | + | no data |
| Clear Video HD | + | no data |
| Graphics max frequency | 667 MHz | no data |
Graphics interfaces
Available interfaces and connections of Core i3-370M and Xeon Platinum 8170 integrated GPUs.
| Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-370M and Xeon Platinum 8170.
| PCIe version | 2.0 | 3.0 |
| PCI Express lanes | 16 | 48 |
Pros & cons summary
| Recency | 20 June 2010 | 25 April 2017 |
| Physical cores | 2 | 26 |
| Threads | 4 | 52 |
| Chip lithography | 32 nm | 14 nm |
| Power consumption (TDP) | 35 Watt | 165 Watt |
i3-370M has 371.4% lower power consumption.
Xeon Platinum 8170, on the other hand, has an age advantage of 6 years, 1200% more physical cores and 1200% more threads, and a 128.6% more advanced lithography process.
We couldn't decide between Intel Core i3-370M and Intel Xeon Platinum 8170. We've got no test results to judge.
Be aware that Core i3-370M is a notebook processor while Xeon Platinum 8170 is a server/workstation one.
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