Ryzen 9 5900HS vs i3-370M

Place in the ranking	2673	541
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Core i3	AMD Cezanne (Zen 3, Ryzen 5000)
Power efficiency	1.97	36.85
Architecture codename	Arrandale (2010−2011)	Cezanne-HS (Zen 3) (2021)
Release date	20 June 2010 (14 years ago)	12 January 2021 (3 years ago)
Launch price (MSRP)	$245	no data

Detailed specifications

Core i3-370M and Ryzen 9 5900HS basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	8 (Octa-Core)
Threads	4	16
Base clock speed	2.4 GHz	3 GHz
Boost clock speed	2.4 GHz	4.6 GHz
Bus type	DMI 1.0	no data
Bus rate	1 × 2.5 GT/s	no data
Multiplier	18	30
L1 cache	64K (per core)	64 KB (per core)
L2 cache	256K (per core)	512 KB (per core)
L3 cache	3 MB (shared)	16 MB (shared)
Chip lithography	32 nm	7 nm
Die size	81+114 mm²	180 mm²
Maximum core temperature	90 °C for rPGA, 105 °C for BGA	no data
Number of transistors	382+177 Million	10,700 million
64 bit support	+	+
Windows 11 compatibility	-	+

Compatibility

Information on Core i3-370M and Ryzen 9 5900HS compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	PGA988	FP6
Power consumption (TDP)	35 Watt	35 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-370M and Ryzen 9 5900HS. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME
AES-NI	-	+
FMA	+	+
AVX	-	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
PAE	36 Bit	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Core i3-370M and Ryzen 9 5900HS technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-370M and Ryzen 9 5900HS are enumerated here.

AMD-V	-	+
VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-370M and Ryzen 9 5900HS. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4
Maximum memory size	8 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	17.051 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for Previous Generation Intel® Processors	AMD Radeon RX Vega 8 (Ryzen 4000/5000)
Clear Video	+	no data
Clear Video HD	+	no data
Graphics max frequency	667 MHz	no data

Graphics interfaces

Available interfaces and connections of Core i3-370M and Ryzen 9 5900HS integrated GPUs.

Number of displays supported

no data

Peripherals

Specifications and connection of peripherals supported by Core i3-370M and Ryzen 9 5900HS.

PCIe version	2.0	3.0
PCI Express lanes	16	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

Combined synthetic benchmark score

This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.

i3-370M 0.73

Ryzen 9 5900HS 13.63
+1767%

Passmark

Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.

i3-370M 1157

Ryzen 9 5900HS 21645
+1771%

Cinebench 10 32-bit single-core

Cinebench R10 is an ancient ray tracing benchmark for processors by Maxon, authors of Cinema 4D. Its single core version uses just one CPU thread to render a futuristic looking motorcycle.

i3-370M 2690

Ryzen 9 5900HS 6380
+137%

Cinebench 10 32-bit multi-core

Cinebench Release 10 Multi Core is a variant of Cinebench R10 using all the processor threads. Possible number of threads is limited by 16 in this version.

i3-370M 6204

Ryzen 9 5900HS 41235
+565%

Cinebench 11.5 64-bit multi-core

Cinebench Release 11.5 Multi Core is a variant of Cinebench R11.5 which uses all the processor threads. A maximum of 64 threads is supported in this version.

i3-370M 2

Ryzen 9 5900HS 25
+1160%

Gaming performance

Pros & cons summary

Performance score	0.73	13.63
Recency	20 June 2010	12 January 2021
Physical cores	2	8
Threads	4	16
Chip lithography	32 nm	7 nm

Ryzen 9 5900HS has a 1767.1% higher aggregate performance score, an age advantage of 10 years, 300% more physical cores and 300% more threads, and a 357.1% more advanced lithography process.

The Ryzen 9 5900HS is our recommended choice as it beats the Core i3-370M in performance tests.

Should you still have questions on choice between Core i3-370M and Ryzen 9 5900HS, ask them in Comments section, and we shall answer.