Sempron LE-1150 vs i3-330M
Aggregate performance score
Core i3-330M outperforms Sempron LE-1150 by a whopping 300% based on our aggregate benchmark results.
Primary details
Comparing Core i3-330M and Sempron LE-1150 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2768 | 3302 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Desktop processor |
| Series | Intel Core i3 | no data |
| Power efficiency | 1.73 | 0.34 |
| Architecture codename | Arrandale (2010−2011) | Sparta (2007) |
| Release date | 7 January 2010 (14 years ago) | August 2007 (17 years ago) |
| Launch price (MSRP) | $49 | no data |
Detailed specifications
Core i3-330M and Sempron LE-1150 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 4 | 1 |
| Base clock speed | 2.13 GHz | no data |
| Boost clock speed | 0.13 GHz | 2 GHz |
| Bus type | DMI 1.0 | no data |
| Bus rate | 1 × 2.5 GT/s | no data |
| Multiplier | 16 | no data |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 256 KB (per core) | 256 KB |
| L3 cache | 3 MB (shared) | 0 KB |
| Chip lithography | 32 nm | 65 nm |
| Die size | 81+114 mm2 | no data |
| Maximum core temperature | 90 °C for rPGA, 105 °C for BGA | no data |
| Number of transistors | 382 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on Core i3-330M and Sempron LE-1150 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 |
| Socket | BGA1288,PGA988 | AM2 |
| Power consumption (TDP) | 35 Watt | 45 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-330M and Sempron LE-1150. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | no data |
| FMA | + | - |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | + | no data |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| PAE | 36 Bit | no data |
| FDI | + | no data |
| Fast Memory Access | + | no data |
Security technologies
Core i3-330M and Sempron LE-1150 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-330M and Sempron LE-1150 are enumerated here.
| VT-d | - | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-330M and Sempron LE-1150. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3-800, DDR3-1066 | no data |
| Maximum memory size | 8 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 17.051 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD Graphics for Previous Generation Intel Processors | no data |
| Clear Video | + | no data |
| Clear Video HD | + | no data |
| Graphics max frequency | 667 MHz | no data |
Graphics interfaces
Available interfaces and connections of Core i3-330M and Sempron LE-1150 integrated GPUs.
| Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-330M and Sempron LE-1150.
| PCIe version | 2.0 | no data |
| PCI Express lanes | 16 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 0.64 | 0.16 |
| Physical cores | 2 | 1 |
| Threads | 4 | 1 |
| Chip lithography | 32 nm | 65 nm |
| Power consumption (TDP) | 35 Watt | 45 Watt |
i3-330M has a 300% higher aggregate performance score, 100% more physical cores and 300% more threads, a 103.1% more advanced lithography process, and 28.6% lower power consumption.
The Core i3-330M is our recommended choice as it beats the Sempron LE-1150 in performance tests.
Be aware that Core i3-330M is a notebook processor while Sempron LE-1150 is a desktop one.
Should you still have questions on choice between Core i3-330M and Sempron LE-1150, ask them in Comments section, and we shall answer.
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