Ryzen AI 9 HX 475 vs Duo L2400
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 3512 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Core Duo | no data |
| Power efficiency | 0.94 | no data |
| Designer | Intel | AMD |
| Architecture codename | Yonah (2005−2006) | Gorgon Point |
| Release date | no data | no data |
Detailed specifications
Core Duo L2400 and Ryzen AI 9 HX 475 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 12 (Dodeca-Core) |
| Threads | 2 | 24 |
| Base clock speed | 1.66 GHz | 2 GHz |
| Boost clock speed | 1.66 GHz | 5.2 GHz |
| Bus rate | 533 MHz | no data |
| L3 cache | 2 MB L2 Cache | no data |
| Chip lithography | 65 nm | no data |
| Maximum core temperature | 100 °C | no data |
| 64 bit support | - | - |
| Windows 11 compatibility | - | no data |
| VID voltage range | 1.0V - 1.212V | no data |
Compatibility
Information on Core Duo L2400 and Ryzen AI 9 HX 475 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | PBGA479 | no data |
| Power consumption (TDP) | 15 Watt | 54 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core Duo L2400 and Ryzen AI 9 HX 475. You'll probably need this information if you require some particular technology.
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Idle States | - | no data |
| Demand Based Switching | - | no data |
| PAE | 32 Bit | no data |
| FSB parity | - | no data |
Security technologies
Core Duo L2400 and Ryzen AI 9 HX 475 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core Duo L2400 and Ryzen AI 9 HX 475 are enumerated here.
| VT-x | + | no data |
Pros & cons summary
| Physical cores | 2 | 12 |
| Threads | 2 | 24 |
| Power consumption (TDP) | 15 Watt | 54 Watt |
Duo L2400 has 260% lower power consumption.
Ryzen AI 9 HX 475, on the other hand, has 500% more physical cores and 1100% more threads.
We couldn't decide between Intel Core Duo L2400 and AMD Ryzen AI 9 HX 475. We've got no test results to judge.
Other comparisons
We've compiled a selection of CPU comparisons, ranging from closely matched processors to other comparisons that may be of interest.
