Celeron 807 vs N2808

Primary details

Comparing Celeron N2808 and Celeron 807 processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	not rated	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	Intel Celeron
Architecture codename	Bay Trail-M (2013−2014)	Sandy Bridge (2011−2013)
Release date	22 May 2014 (10 years ago)	1 July 2012 (12 years ago)
Launch price (MSRP)	no data	$70

Detailed specifications

Celeron N2808 and Celeron 807 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	2	2
Base clock speed	1.58 GHz	1.5 GHz
Boost clock speed	2.25 GHz	1.5 GHz
L1 cache	56K (per core)	64K (per core)
L2 cache	512K (per core)	256K (per core)
L3 cache	0 KB	1.5 MB (shared)
Chip lithography	22 nm	32 nm
Die size	no data	131 mm2
Maximum core temperature	100 °C	100 °C
Number of transistors	no data	504 million
64 bit support	+	+
Windows 11 compatibility	-	-
Unlocked multiplier	No	No

Compatibility

Information on Celeron N2808 and Celeron 807 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1
Socket	FCBGA1170	FCBGA1023
Power consumption (TDP)	4.5 Watt	17 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron N2808 and Celeron 807. You'll probably need this information if you require some particular technology.

Instruction set extensions	no data	Intel® SSE4.1, Intel® SSE4.2
AES-NI	-	-
FMA	no data	+
Enhanced SpeedStep (EIST)	+	+
My WiFi	no data	-
Turbo Boost Technology	-	-
Hyper-Threading Technology	-	+
Idle States	+	+
Thermal Monitoring	no data	+
Flex Memory Access	no data	+
Demand Based Switching	no data	-
Smart Connect	+	no data
FDI	no data	+
Fast Memory Access	no data	+
Status	Discontinued	Discontinued

Security technologies

Celeron N2808 and Celeron 807 technologies aimed at improving security, for example, by protecting against hacks.

TXT	no data	-
EDB	+	+
Secure Key	+	no data
Anti-Theft	-	-

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron N2808 and Celeron 807 are enumerated here.

VT-d	-	-
VT-x	+	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron N2808 and Celeron 807. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR3
Maximum memory size	4 GB	16 GB
Max memory channels	1	2
Maximum memory bandwidth	10.66 GB/s	21.3 GB/s
ECC memory support	-	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for Intel Atom® Processor Z3700 Series	Intel® HD Graphics for 2nd Generation Intel® Processors
Quick Sync Video	+	-
Clear Video HD	-	-
Graphics max frequency	792 MHz	950 MHz
InTru 3D	-	-

Graphics interfaces

Available interfaces and connections of Celeron N2808 and Celeron 807 integrated GPUs.

Number of displays supported	2	2
eDP	no data	+
DisplayPort	no data	+
HDMI	no data	+
SDVO	no data	+
CRT	no data	+

Peripherals

Specifications and connection of peripherals supported by Celeron N2808 and Celeron 807.

PCIe version	2.0	2.0
PCI Express lanes	4	16
USB revision	3.0 and 2.0	no data
Total number of SATA ports	2	no data
Number of USB ports	5	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	22 May 2014	1 July 2012
Physical cores	2	1
Chip lithography	22 nm	32 nm
Power consumption (TDP)	4 Watt	17 Watt

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