Ryzen 3 8300G vs Celeron 3755U

Primary details

Comparing Celeron 3755U and Ryzen 3 8300G processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	2547	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Desktop processor
Series	Intel Celeron	no data
Architecture codename	Broadwell-U (2015)	Phoenix2
Release date	1 March 2015 (9 years ago)	8 January 2024 (less than a year ago)
Launch price (MSRP)	$107	no data
Current price	$50 (0.5x MSRP)	no data

Detailed specifications

Celeron 3755U and Ryzen 3 8300G basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	4 (Quad-Core)
Threads	2	8
Base clock speed	1.7 GHz	3.4 GHz
Boost clock speed	1.7 GHz	4.9 GHz
L1 cache	64K (per core)	64 KB (per core)
L2 cache	256K (per core)	1 MB (per core)
L3 cache	2 MB (shared)	8 MB (shared)
Chip lithography	14 nm	4 nm
Die size	82 mm2	137 mm2
Maximum core temperature	105 °C	no data
Maximum case temperature (TCase)	105 °C	no data
Number of transistors	1300 Million	20,900 million
64 bit support	+	+
Windows 11 compatibility	-	no data
Unlocked multiplier	No	No

Compatibility

Information on Celeron 3755U and Ryzen 3 8300G compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1
Socket	FCBGA1168	AM5
Power consumption (TDP)	15 Watt	65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron 3755U and Ryzen 3 8300G. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
AES-NI	+	+
AVX	+	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
TSX	-	no data
Idle States	+	no data
Thermal Monitoring	+	no data
Flex Memory Access	+	no data
SIPP	-	no data
Smart Response	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Status	Discontinued	no data

Security technologies

Celeron 3755U and Ryzen 3 8300G technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Secure Key	+	no data
Identity Protection	+	no data
OS Guard	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron 3755U and Ryzen 3 8300G are enumerated here.

AMD-V	+	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron 3755U and Ryzen 3 8300G. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR5
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 5th Generation Intel® Processors	AMD Radeon 740M
Quick Sync Video	+	no data
Clear Video	+	no data
Graphics max frequency	800 MHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Celeron 3755U and Ryzen 3 8300G integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	no data
HDMI	+	no data

Graphics API support

APIs supported by Celeron 3755U and Ryzen 3 8300G integrated GPUs, sometimes API versions are included.

DirectX

11.2/12

no data

Peripherals

Specifications and connection of peripherals supported by Celeron 3755U and Ryzen 3 8300G.

PCIe version	2.0	4.0
PCI Express lanes	12	14

Pros & cons summary

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Recency	1 March 2015	8 January 2024
Physical cores	2	4
Threads	2	8
Chip lithography	14 nm	4 nm
Power consumption (TDP)	15 Watt	65 Watt

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