Phenom II X3 P860 vs Celeron 2957U

Primary details

Comparing Celeron 2957U and Phenom II X3 P860 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2856	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	3x AMD Phenom II
Power efficiency	3.41	no data
Architecture codename	Haswell (2013−2015)	Champlain (2010−2011)
Release date	1 January 2014 (10 years ago)	4 October 2010 (14 years ago)
Launch price (MSRP)	$107	no data

Detailed specifications

Celeron 2957U and Phenom II X3 P860 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	3 (Tri-Core)
Threads	2	3
Base clock speed	1.4 GHz	no data
Boost clock speed	1.4 GHz	2 GHz
Bus rate	5 GT/s	3600 MHz
L1 cache	128 KB	384 KB
L2 cache	512 KB	1.5 MB
L3 cache	2 MB	no data
Chip lithography	22 nm	45 nm
Maximum core temperature	100 °C	no data
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Celeron 2957U and Phenom II X3 P860 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	no data
Socket	FCBGA1168	S1
Power consumption (TDP)	15 Watt	25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron 2957U and Phenom II X3 P860. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Virtualization, AMD64, Advanced Virus Protection, SSE(1,2,3,4a)
VirusProtect	-	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	-
Smart Response	-	no data
GPIO	+	no data
Smart Connect	+	no data
FDI	-	no data
AMT	9.5	no data
Matrix Storage	-	no data
HD Audio	+	no data
RST	+	no data

Security technologies

Celeron 2957U and Phenom II X3 P860 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Secure Key	+	no data
OS Guard	-	no data
Anti-Theft	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron 2957U and Phenom II X3 P860 are enumerated here.

AMD-V	+	+
VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron 2957U and Phenom II X3 P860. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR3
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics for 4th Generation Intel Processors	no data
Quick Sync Video	+	-
Clear Video	+	no data
Graphics max frequency	1 GHz	no data

Graphics interfaces

Available interfaces and connections of Celeron 2957U and Phenom II X3 P860 integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-

Peripherals

Specifications and connection of peripherals supported by Celeron 2957U and Phenom II X3 P860.

PCIe version	2.0	no data
PCI Express lanes	10	no data
PCI support	-	no data
USB revision	3.0	no data
Total number of SATA ports	2	no data
Max number of SATA 6 Gb/s Ports	2	no data
Integrated IDE	-	no data
Number of USB ports	4	no data
Integrated LAN	-	no data
UART	+	no data

Pros & cons summary

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Recency	1 January 2014	4 October 2010
Physical cores	2	3
Threads	2	3
Chip lithography	22 nm	45 nm
Power consumption (TDP)	15 Watt	25 Watt

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