B100 vs FirePro M8900
Contents
Primary details
GPU architecture, market segment, value for money and other general parameters compared.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Architecture | TeraScale 2 (2009−2015) | Blackwell (2024−2025) |
| GPU code name | Blackcomb | GB102 |
| Market segment | Mobile workstation | Workstation |
| Release date | 12 April 2011 (14 years ago) | November 2024 (1 year ago) |
Detailed specifications
General parameters such as number of shaders, GPU core base clock and boost clock speeds, manufacturing process, texturing and calculation speed. Note that power consumption of some graphics cards can well exceed their nominal TDP, especially when overclocked.
| Pipelines / CUDA cores | 960 | 16896 ×2 |
| Core clock speed | 680 MHz | 1665 MHz |
| Boost clock speed | no data | 1837 MHz |
| Number of transistors | 1,700 million | 104,000 million |
| Manufacturing process technology | 40 nm | 5 nm |
| Power consumption (TDP) | 75 Watt | 1000 Watt |
| Texture fill rate | 32.64 | 969.9 ×2 |
| Floating-point processing power | 1.306 TFLOPS | 62.08 TFLOPS ×2 |
| ROPs | 32 | 24 ×2 |
| TMUs | 48 | 528 ×2 |
| Tensor Cores | no data | 528 ×2 |
| L1 Cache | 192 KB | 33 MB |
| L2 Cache | 512 KB | 50 MB |
Form factor & compatibility
Information on compatibility with other computer components. Useful when choosing a future computer configuration or upgrading an existing one. For desktop graphics cards it's interface and bus (motherboard compatibility), additional power connectors (power supply compatibility).
| Laptop size | large | no data |
| Bus support | n/a | no data |
| Interface | MXM-B (3.0) | PCIe 5.0 x16 |
| Width | no data | SXM Module |
| Form factor | MXM-B | no data |
| Supplementary power connectors | None | no data |
VRAM capacity and type
Parameters of VRAM installed: its type, size, bus, clock and resulting bandwidth. Integrated GPUs have no dedicated video RAM and use a shared part of system RAM.
| Memory type | GDDR5 | HBM3e |
| Maximum RAM amount | 2 GB | 96 GB ×2 |
| Memory bus width | 256 Bit | 4096 Bit ×2 |
| Memory clock speed | 900 MHz | 2000 MHz |
| Memory bandwidth | 115 GB/s | 4.1 TB/s ×2 |
| Shared memory | - | - |
| Resizable BAR | - | + |
Connectivity and outputs
This section shows the types and number of video connectors on each GPU. The data applies specifically to desktop reference models (for example, NVIDIA’s Founders Edition). OEM partners often modify both the number and types of ports. On notebook GPUs, video‐output options are determined by the laptop’s design rather than the graphics chip itself.
| Display Connectors | No outputs | No outputs |
API and SDK support
List of supported 3D and general-purpose computing APIs, including their specific versions.
| DirectX | 11.2 (11_0) | N/A |
| Shader Model | 5.0 | N/A |
| OpenGL | 4.4 | N/A |
| OpenCL | 1.2 | 3.0 |
| Vulkan | N/A | N/A |
| CUDA | - | 10.1 |
| DLSS | - | + |
Pros & cons summary
| Maximum RAM amount | 2 GB | 96 GB |
| Chip lithography | 40 nm | 5 nm |
| Power consumption (TDP) | 75 Watt | 1000 Watt |
FirePro M8900 has 1233.3% lower power consumption.
B100, on the other hand, has a 4700% higher maximum VRAM amount, and a 700% more advanced lithography process.
We couldn't decide between FirePro M8900 and B100. We've got no test results to judge.
Be aware that FirePro M8900 is a mobile workstation graphics card while B100 is a workstation one.
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