Ryzen AI 9 HX PRO 370 vs Xeon W-3223
Primary details
Comparing Xeon W-3223 and Ryzen AI 9 HX PRO 370 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 735 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 18.04 | no data |
| Market segment | Server | Laptop |
| Series | Intel Xeon W | Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | 6.31 | no data |
| Architecture codename | Cascade Lake (2019−2020) | Strix Point-HX PRO (Zen 5/5c) (2025) |
| Release date | 3 June 2019 (5 years ago) | January 2025 (recently) |
| Launch price (MSRP) | $749 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Xeon W-3223 and Ryzen AI 9 HX PRO 370 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 8 (Octa-Core) | 12 (Dodeca-Core) |
| Threads | 16 | 24 |
| Base clock speed | 3.5 GHz | 2 GHz |
| Boost clock speed | 4.2 GHz | 5.1 GHz |
| Bus type | DMI 3.0 | no data |
| Bus rate | 4 × 8 GT/s | 54 MHz |
| Multiplier | 35 | no data |
| L1 cache | 512 KB | 80 KB (per core) |
| L2 cache | 8 MB | 1 MB (per core) |
| L3 cache | 16.5 MB | 16 MB |
| Chip lithography | 14 nm | 4 nm |
| Maximum core temperature | 68 °C | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | + | no data |
Compatibility
Information on Xeon W-3223 and Ryzen AI 9 HX PRO 370 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 |
| Socket | FCLGA3647 | FP8 |
| Power consumption (TDP) | 160 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon W-3223 and Ryzen AI 9 HX PRO 370. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® AVX-512 | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX+, SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | + | + |
| AVX | + | + |
| vPro | + | no data |
| Enhanced SpeedStep (EIST) | + | no data |
| Speed Shift | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Turbo Boost Max 3.0 | + | no data |
| Precision Boost 2 | no data | + |
| Deep Learning Boost | + | - |
Security technologies
Xeon W-3223 and Ryzen AI 9 HX PRO 370 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon W-3223 and Ryzen AI 9 HX PRO 370 are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon W-3223 and Ryzen AI 9 HX PRO 370. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4-2666 | DDR5 |
| Maximum memory size | 1 TB | no data |
| Max memory channels | 6 | no data |
| Maximum memory bandwidth | 128.001 GB/s | no data |
| ECC memory support | + | - |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon 890M ( - 2900 MHz) |
Peripherals
Specifications and connection of peripherals supported by Xeon W-3223 and Ryzen AI 9 HX PRO 370.
| PCIe version | 3.0 | 4.0 |
| PCI Express lanes | 64 | 16 |
Pros & cons summary
| Physical cores | 8 | 12 |
| Threads | 16 | 24 |
| Chip lithography | 14 nm | 4 nm |
| Power consumption (TDP) | 160 Watt | 28 Watt |
Ryzen AI 9 HX PRO 370 has 50% more physical cores and 50% more threads, a 250% more advanced lithography process, and 471.4% lower power consumption.
We couldn't decide between Xeon W-3223 and Ryzen AI 9 HX PRO 370. We've got no test results to judge.
Be aware that Xeon W-3223 is a server/workstation processor while Ryzen AI 9 HX PRO 370 is a notebook one.
Should you still have questions on choice between Xeon W-3223 and Ryzen AI 9 HX PRO 370, ask them in Comments section, and we shall answer.
Other comparisons
We've compiled a selection of CPU comparisons, ranging from closely matched processors to other comparisons that may be of interest.
