Pentium G632 vs Xeon W-2102

Primary details

Comparing Xeon W-2102 and Pentium G632 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1575	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	6.90	no data
Market segment	Server	Desktop processor
Series	Intel Xeon W	no data
Architecture codename	Skylake (server) (2017−2018)	Sandy Bridge (2011−2013)
Release date	29 August 2017 (7 years ago)	4 September 2011 (13 years ago)
Launch price (MSRP)	$202	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon W-2102 and Pentium G632 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	2 (Dual-core)
Threads	4	2
Base clock speed	2.9 GHz	2.7 GHz
Boost clock speed	2.9 GHz	2.7 GHz
Bus type	DMI 3.0	no data
Bus rate	4 × 8 GT/s	no data
Multiplier	29	no data
L1 cache	64K (per core)	64 KB (per core)
L2 cache	1 MB (per core)	256 KB (per core)
L3 cache	8.25 MB (shared)	3 MB (shared)
Chip lithography	14 nm	32 nm
Die size	484 mm2	131 mm2
Maximum core temperature	no data	69 °C
Maximum case temperature (TCase)	66 °C	no data
Number of transistors	no data	504 million
64 bit support	+	+
Windows 11 compatibility	+	-

Compatibility

Information on Xeon W-2102 and Pentium G632 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCLGA2066	FCLGA1155
Power consumption (TDP)	120 Watt	65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon W-2102 and Pentium G632. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512	Intel® SSE4.1, Intel® SSE4.2
AES-NI	+	+
AVX	+	+
vPro	+	no data
Enhanced SpeedStep (EIST)	+	+
Speed Shift	+	no data
Turbo Boost Technology	-	-
Hyper-Threading Technology	-	-
TSX	+	-
Idle States	+	+
Thermal Monitoring	+	+
Flex Memory Access	-	+
Demand Based Switching	+	no data
PAE	46 Bit	no data
Turbo Boost Max 3.0	-	no data
FDI	no data	+
Fast Memory Access	no data	+
Status	Launched	Discontinued

Security technologies

Xeon W-2102 and Pentium G632 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	-
EDB	+	+
Secure Key	+	no data
MPX	+	-
Identity Protection	+	-
SGX	-	no data
OS Guard	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon W-2102 and Pentium G632 are enumerated here.

VT-d	+	-
VT-x	+	+
EPT	+	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon W-2102 and Pentium G632. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR4-1600, DDR4-1866, DDR4-2133, DDR4-2400	DDR3
Maximum memory size	512 GB	32 GB
Max memory channels	4	2
Maximum memory bandwidth	76.805 GB/s	17 GB/s
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	no data	Intel® HD Graphics for 2nd Generation Intel® Processors
Graphics max frequency	no data	1.1 GHz

Graphics interfaces

Available interfaces and connections of Xeon W-2102 and Pentium G632 integrated GPUs.

Number of displays supported

no data

2

Peripherals

Specifications and connection of peripherals supported by Xeon W-2102 and Pentium G632.

PCIe version	3.0	2.0
PCI Express lanes	48	no data

Pros & cons summary

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Recency	29 August 2017	4 September 2011
Physical cores	4	2
Threads	4	2
Chip lithography	14 nm	32 nm
Power consumption (TDP)	120 Watt	65 Watt

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