Ryzen 9 7945HX3D vs Xeon E7-2850
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 146 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Server | Laptop |
| Series | Intel Xeon E7 | AMD Dragon Range (Zen 4, Ryzen 7045) |
| Power efficiency | no data | 63.90 |
| Designer | Intel | AMD |
| Manufacturer | Intel | TSMC |
| Architecture codename | Westmere-EX (2011) | Dragon Range-HX (Zen 4) (2023−2024) |
| Release date | 3 April 2011 (14 years ago) | 27 July 2023 (2 years ago) |
| Launch price (MSRP) | $2,558 | no data |
Detailed specifications
Xeon E7-2850 and Ryzen 9 7945HX3D basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 10 (Deca-Core) | 16 (Hexadeca-Core) |
| Threads | 20 | 32 |
| Base clock speed | 2 GHz | 2.3 GHz |
| Boost clock speed | 2.4 GHz | 5.4 GHz |
| Bus type | QPI | no data |
| Bus rate | 6.4 GT/s | no data |
| Multiplier | 15 | no data |
| L1 cache | 64 KB (per core) | 64 KB (per core) |
| L2 cache | 256 KB (per core) | 1 MB (per core) |
| L3 cache | 24 MB (shared) | 128 MB (shared) |
| Chip lithography | 32 nm | 5 nm |
| Die size | 513 mm2 | 2x 71 mm2 |
| Maximum core temperature | no data | 89 °C |
| Maximum case temperature (TCase) | 69 °C | no data |
| Number of transistors | 2,600 million | 17,840 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | no data |
| Unlocked multiplier | - | + |
Compatibility
Information on Xeon E7-2850 and Ryzen 9 7945HX3D compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 2 (Multiprocessor) | 1 |
| Socket | LGA1567 | FL1 |
| Power consumption (TDP) | 130 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon E7-2850 and Ryzen 9 7945HX3D. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | no data |
| AES-NI | + | + |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | 1.0 | no data |
| Hyper-Threading Technology | + | no data |
| Thermal Monitoring | + | - |
| Precision Boost 2 | no data | + |
Security technologies
Xeon E7-2850 and Ryzen 9 7945HX3D technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon E7-2850 and Ryzen 9 7945HX3D are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon E7-2850 and Ryzen 9 7945HX3D. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3-800, DDR3-978, DDR3-1066, DDR3-1333, Speed-1066 | DDR5-5200 |
| Maximum memory size | 1 TB | no data |
| Max memory channels | 4 | no data |
| Maximum memory bandwidth | 34.113 GB/s | no data |
| ECC memory support | + | - |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | AMD Radeon 610M (400 - 2200 MHz) |
Peripherals
Specifications and connection of peripherals supported by Xeon E7-2850 and Ryzen 9 7945HX3D.
| PCIe version | no data | 5.0 |
| PCI Express lanes | no data | 28 |
Pros & cons summary
| Recency | 3 April 2011 | 27 July 2023 |
| Physical cores | 10 | 16 |
| Threads | 20 | 32 |
| Chip lithography | 32 nm | 5 nm |
| Power consumption (TDP) | 130 Watt | 55 Watt |
Ryzen 9 7945HX3D has an age advantage of 12 years, 60% more physical cores and 60% more threads, a 540% more advanced lithography process, and 136.4% lower power consumption.
We couldn't decide between Intel Xeon E7-2850 and AMD Ryzen 9 7945HX3D. We've got no test results to judge.
Be aware that Xeon E7-2850 is a server/workstation processor while Ryzen 9 7945HX3D is a notebook one.
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