Ryzen AI Max 390 vs Xeon E-2224

Primary details

Comparing Xeon E-2224 and Ryzen AI Max 390 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1311	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	23.61	no data
Market segment	Server	Laptop
Series	Intel Xeon E	no data
Power efficiency	6.07	no data
Architecture codename	Coffee Lake-S WS (2018−2019)	Strix Halo (2025)
Release date	29 May 2019 (5 years ago)	6 January 2025 (recently)
Launch price (MSRP)	$193	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E-2224 and Ryzen AI Max 390 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	12 (Dodeca-Core)
Threads	4	24
Base clock speed	3.4 GHz	3.2 GHz
Boost clock speed	4.6 GHz	5 GHz
Bus type	DMI 3.0	no data
Bus rate	4 × 8 GT/s	no data
Multiplier	34	no data
L1 cache	64 KB (per core)	80 KB (per core)
L2 cache	256 KB (per core)	1 MB (per core)
L3 cache	8 MB (shared)	64 MB (shared)
Chip lithography	14 nm	4 nm
Die size	126 mm2	no data
Maximum core temperature	100 °C	no data
64 bit support	+	+
Windows 11 compatibility	+	no data

Compatibility

Information on Xeon E-2224 and Ryzen AI Max 390 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCLGA1151	FP11
Power consumption (TDP)	71 Watt	55 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E-2224 and Ryzen AI Max 390. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	no data
AES-NI	+	+
AVX	+	+
vPro	+	no data
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	-	no data
TSX	+	-
Idle States	+	no data
Thermal Monitoring	+	-
Precision Boost 2	no data	+

Security technologies

Xeon E-2224 and Ryzen AI Max 390 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Secure Key	+	no data
MPX	+	-
SGX	Yes with Intel® ME	no data
OS Guard	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E-2224 and Ryzen AI Max 390 are enumerated here.

AMD-V	-	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E-2224 and Ryzen AI Max 390. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR4-2666	no data
Maximum memory size	128 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	42.671 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card

Intel UHD Graphics P630

Radeon 8050S

Graphics image quality

Maximum display resolutions supported by Xeon E-2224 and Ryzen AI Max 390 integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	N/A	no data
Max resolution over eDP	N/A	no data
Max resolution over DisplayPort	N/A	no data
Max resolution over VGA	N/A	no data

Graphics API support

APIs supported by Xeon E-2224 and Ryzen AI Max 390 integrated GPUs, sometimes API versions are included.

DirectX	N/A	no data
OpenGL	N/A	no data

Peripherals

Specifications and connection of peripherals supported by Xeon E-2224 and Ryzen AI Max 390.

PCIe version	3.0	4.0
PCI Express lanes	16	16

Pros & cons summary

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Recency	29 May 2019	6 January 2025
Physical cores	4	12
Threads	4	24
Chip lithography	14 nm	4 nm
Power consumption (TDP)	71 Watt	55 Watt

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