Ryzen Embedded 7645 vs VIA C3 Processor 1.0A

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Primary details

Comparing processor market type (desktop or notebook), architecture, sales start time and price.

Place in the rankingnot ratednot rated
Place by popularitynot in top-100not in top-100
Market segmentDesktop processorDesktop processor
DesignerVIAAMD
ManufacturerTSMCTSMC
Architecture codenameEzra-T (2002)Raphael (2023−2025)
Release date3 June 2002 (23 years ago)14 November 2023 (2 years ago)

Detailed specifications

Basic parameters of VIA C3 Processor 1.0A and Ryzen Embedded 7645: number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores1 (Single-Core)6 (Hexa-Core)
Threads112
Base clock speedno data3.8 GHz
Boost clock speed1 GHz5.1 GHz
L1 cache128 KB64 KB (per core)
L2 cache64 KB1 MB (per core)
L3 cacheno data32 MB (shared)
Chip lithography130 nm5 nm
Die size56 mm271 mm2
Number of transistors16 million6,570 million
64 bit support-+

Compatibility

Information on VIA C3 Processor 1.0A and Ryzen Embedded 7645 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration11
Socket370AM5
Power consumption (TDP)10 Watt65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by VIA C3 Processor 1.0A and Ryzen Embedded 7645. You'll probably need this information if you require some particular technology.

AES-NI-+
AVX-+
Precision Boost 2no data+

Virtualization technologies

Virtual machine speed-up technologies supported by VIA C3 Processor 1.0A and Ryzen Embedded 7645 are enumerated here.

AMD-V-+

Memory specs

Types, maximum amount and channel quantity of RAM supported by VIA C3 Processor 1.0A and Ryzen Embedded 7645. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesno dataDDR5

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardno dataAMD Radeon Graphics

Peripherals

Specifications and connection of peripherals supported by VIA C3 Processor 1.0A and Ryzen Embedded 7645.

PCIe versionno data5.0
PCI Express lanesno data24

Pros & cons summary


Recency 3 June 2002 14 November 2023
Physical cores 1 6
Threads 1 12
Chip lithography 130 nm 5 nm
Power consumption (TDP) 10 Watt 65 Watt

VIA C3 Processor 1.0A has 550% lower power consumption.

Ryzen Embedded 7645, on the other hand, has an age advantage of 21 years, 500% more physical cores and 1100% more threads, and a 2500% more advanced lithography process.

We couldn't decide between VIA C3 Processor 1.0A and AMD Ryzen Embedded 7645. We've got no test results to judge.

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Community ratings

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