Ultra 7 265F vs Sempron 3200+ EE SFF
Primary details
Comparing Sempron 3200+ EE SFF and Core Ultra 7 265F processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Desktop processor | Desktop processor |
| Architecture codename | Manila (2001−2006) | Arrow Lake-S (2024−2025) |
| Release date | May 2006 (18 years ago) | January 2025 |
Detailed specifications
Sempron 3200+ EE SFF and Core Ultra 7 265F basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 20 (Icosa-Core) |
| Threads | 1 | 20 |
| Base clock speed | no data | 2.4 GHz |
| Boost clock speed | 1.8 GHz | 5.3 GHz |
| L1 cache | 128 KB | 112 KB (per core) |
| L2 cache | 128 KB | 3 MB (per core) |
| L3 cache | 0 KB | 30 MB (shared) |
| Chip lithography | 90 nm | 3 nm |
| Die size | 103 mm2 | 243 mm2 |
| Number of transistors | 81 million | 17,800 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | no data |
Compatibility
Information on Sempron 3200+ EE SFF and Core Ultra 7 265F compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | AM2 | 1851 |
| Power consumption (TDP) | 35 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Sempron 3200+ EE SFF and Core Ultra 7 265F. You'll probably need this information if you require some particular technology.
| AES-NI | - | + |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | no data | + |
| TSX | - | + |
Security technologies
Sempron 3200+ EE SFF and Core Ultra 7 265F technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Sempron 3200+ EE SFF and Core Ultra 7 265F are enumerated here.
| VT-d | no data | + |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Sempron 3200+ EE SFF and Core Ultra 7 265F. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR5 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | N/A |
Peripherals
Specifications and connection of peripherals supported by Sempron 3200+ EE SFF and Core Ultra 7 265F.
| PCIe version | no data | 5.0 |
| PCI Express lanes | no data | 20 |
Pros & cons summary
| Physical cores | 1 | 20 |
| Threads | 1 | 20 |
| Chip lithography | 90 nm | 3 nm |
| Power consumption (TDP) | 35 Watt | 65 Watt |
Sempron 3200+ EE SFF has 85.7% lower power consumption.
Ultra 7 265F, on the other hand, has 1900% more physical cores and 1900% more threads, and a 2900% more advanced lithography process.
We couldn't decide between Sempron 3200+ EE SFF and Core Ultra 7 265F. We've got no test results to judge.
Should you still have questions on choice between Sempron 3200+ EE SFF and Core Ultra 7 265F, ask them in Comments section, and we shall answer.
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