EPYC Embedded 2875 vs Ryzen AI 9 HX PRO 370
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 383 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Server |
| Series | Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | no data |
| Power efficiency | 28.41 | no data |
| Designer | AMD | AMD |
| Manufacturer | TSMC | TSMC |
| Architecture codename | Strix Point-HX PRO (Zen 5/5c) (2025) | Grado (2025) |
| Release date | 6 January 2025 (1 year ago) | 9 December 2025 (less than a year ago) |
Detailed specifications
Ryzen AI 9 HX PRO 370 and EPYC Embedded 2875 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 16 (Hexadeca-Core) |
| Threads | 24 | 32 |
| Base clock speed | 2 GHz | 3 GHz |
| Boost clock speed | 5.1 GHz | 4.5 GHz |
| Bus rate | 54 MHz | no data |
| L1 cache | 80 KB (per core) | 80 KB (per core) |
| L2 cache | 1 MB (per core) | 1 MB (per core) |
| L3 cache | 16 MB | 64 MB (shared) |
| Chip lithography | 4 nm | 4 nm |
| Die size | 233 mm2 | 70.6 mm2 |
| Number of transistors | no data | 16,630 million |
| 64 bit support | - | + |
Compatibility
Information on Ryzen AI 9 HX PRO 370 and EPYC Embedded 2875 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FP8 | FL1 |
| Power consumption (TDP) | 28 Watt | 75 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX PRO 370 and EPYC Embedded 2875. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX+, SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | + |
| AVX | + | + |
| Precision Boost 2 | + | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX PRO 370 and EPYC Embedded 2875 are enumerated here.
| AMD-V | + | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX PRO 370 and EPYC Embedded 2875. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR5 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M ( - 2900 MHz) | AMD Radeon Graphics |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX PRO 370 and EPYC Embedded 2875.
| PCIe version | 4.0 | 5.0 |
| PCI Express lanes | 16 | 28 |
Pros & cons summary
| Integrated graphics card | 19.52 | 1.83 |
| Recency | 6 January 2025 | 9 December 2025 |
| Physical cores | 12 | 16 |
| Threads | 24 | 32 |
| Power consumption (TDP) | 28 Watt | 75 Watt |
Ryzen AI 9 HX PRO 370 has 966.7% faster integrated GPU, and 167.9% lower power consumption.
EPYC Embedded 2875, on the other hand, has an age advantage of 11 months, and 33.3% more physical cores and 33.3% more threads.
We couldn't decide between AMD Ryzen AI 9 HX PRO 370 and AMD EPYC Embedded 2875. We've got no test results to judge.
Be aware that Ryzen AI 9 HX PRO 370 is a notebook processor while EPYC Embedded 2875 is a server/workstation one.
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