Xeon W-2155 vs Ryzen AI 9 HX 375
Aggregate performance score
Ryzen AI 9 HX 375 outperforms Xeon W-2155 by a considerable 44% based on our aggregate benchmark results.
Primary details
Comparing Ryzen AI 9 HX 375 and Xeon W-2155 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 302 | 559 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 7.61 |
| Market segment | Laptop | Server |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | Intel Xeon W |
| Power efficiency | 33.40 | 8.97 |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Skylake (server) (2017−2019) |
| Release date | 25 July 2024 (less than a year ago) | 29 August 2017 (7 years ago) |
| Launch price (MSRP) | no data | $1,440 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Ryzen AI 9 HX 375 and Xeon W-2155 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 10 (Deca-Core) |
| Threads | 24 | 20 |
| Base clock speed | 2 GHz | 3.3 GHz |
| Boost clock speed | 5.1 GHz | 4.5 GHz |
| Bus type | no data | DMI 3.0 |
| Bus rate | no data | 4 × 8 GT/s |
| Multiplier | no data | 33 |
| L1 cache | no data | 640 KB |
| L2 cache | 12 MB | 10 MB |
| L3 cache | 24 MB | 13.75 MB (shared) |
| Chip lithography | 4 nm | 14 nm |
| Die size | no data | 484 mm2 |
| Maximum core temperature | 100 °C | no data |
| Maximum case temperature (TCase) | no data | 68 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | + |
Compatibility
Information on Ryzen AI 9 HX 375 and Xeon W-2155 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | FP8 | FCLGA2066 |
| Power consumption (TDP) | 54 Watt | 140 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Xeon W-2155. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 |
| AES-NI | + | + |
| AVX | + | + |
| vPro | no data | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Speed Shift | no data | + |
| Turbo Boost Technology | no data | 2.0 |
| Hyper-Threading Technology | no data | + |
| TSX | - | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | - |
| Demand Based Switching | no data | + |
| PAE | no data | 46 Bit |
| Turbo Boost Max 3.0 | no data | - |
Security technologies
Ryzen AI 9 HX 375 and Xeon W-2155 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
| EDB | no data | + |
| Secure Key | no data | + |
| MPX | - | + |
| Identity Protection | - | + |
| SGX | no data | - |
| OS Guard | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 375 and Xeon W-2155 are enumerated here.
| VT-d | no data | + |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Xeon W-2155. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4-1600, DDR4-1866, DDR4-2133, DDR4-2400, DDR4-2666 |
| Maximum memory size | no data | 512 GB |
| Max memory channels | no data | 4 |
| Maximum memory bandwidth | no data | 85.33 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | no data |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 375 and Xeon W-2155.
| PCIe version | no data | 3.0 |
| PCI Express lanes | no data | 48 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 19.42 | 13.52 |
| Recency | 25 July 2024 | 29 August 2017 |
| Physical cores | 12 | 10 |
| Threads | 24 | 20 |
| Chip lithography | 4 nm | 14 nm |
| Power consumption (TDP) | 54 Watt | 140 Watt |
Ryzen AI 9 HX 375 has a 43.6% higher aggregate performance score, an age advantage of 6 years, 20% more physical cores and 20% more threads, a 250% more advanced lithography process, and 159.3% lower power consumption.
The Ryzen AI 9 HX 375 is our recommended choice as it beats the Xeon W-2155 in performance tests.
Be aware that Ryzen AI 9 HX 375 is a notebook processor while Xeon W-2155 is a server/workstation one.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Xeon W-2155, ask them in Comments section, and we shall answer.
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