Celeron B810 vs Ryzen AI 9 HX 375
Aggregate performance score
Ryzen AI 9 HX 375 outperforms Celeron B810 by a whopping 3916% based on our aggregate benchmark results.
Primary details
Comparing Ryzen AI 9 HX 375 and Celeron B810 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 291 | 2906 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | Intel Celeron |
| Power efficiency | 34.49 | 1.32 |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Sandy Bridge (2011−2013) |
| Release date | 25 July 2024 (less than a year ago) | 1 March 2011 (13 years ago) |
| Launch price (MSRP) | no data | $86 |
Detailed specifications
Ryzen AI 9 HX 375 and Celeron B810 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
| Threads | 24 | 2 |
| Base clock speed | 2 GHz | 1.6 GHz |
| Boost clock speed | 5.1 GHz | 1.6 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | no data | 4 × 5 GT/s |
| Multiplier | no data | 16 |
| L1 cache | no data | 64K (per core) |
| L2 cache | 12 MB | 256K (per core) |
| L3 cache | 24 MB | 2 MB (shared) |
| Chip lithography | 4 nm | 32 nm |
| Die size | no data | 131 mm2 |
| Maximum core temperature | 100 °C | 100 °C |
| Number of transistors | no data | 504 million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Celeron B810 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | FP8 | PGA988 |
| Power consumption (TDP) | 54 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Celeron B810. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | Intel® SSE4.1, Intel® SSE4.2 |
| AES-NI | + | - |
| FMA | - | + |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| My WiFi | no data | - |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | - |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | + |
| Demand Based Switching | no data | - |
| FDI | no data | + |
| Fast Memory Access | no data | + |
Security technologies
Ryzen AI 9 HX 375 and Celeron B810 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
| Anti-Theft | no data | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 375 and Celeron B810 are enumerated here.
| VT-d | no data | - |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Celeron B810. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR3 |
| Maximum memory size | no data | 16.6 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | AMD Radeon 890M ( - 2900 MHz) | Intel HD Graphics for 2nd Generation Intel Processors |
| Graphics max frequency | no data | 950 MHz |
Graphics interfaces
Available interfaces and connections of Ryzen AI 9 HX 375 and Celeron B810 integrated GPUs.
| Number of displays supported | no data | 2 |
| eDP | no data | + |
| DisplayPort | - | + |
| HDMI | - | + |
| SDVO | no data | + |
| CRT | no data | + |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 375 and Celeron B810.
| PCIe version | no data | 2.0 |
| PCI Express lanes | no data | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 19.68 | 0.49 |
| Integrated graphics card | 21.86 | 0.77 |
| Recency | 25 July 2024 | 1 March 2011 |
| Physical cores | 12 | 2 |
| Threads | 24 | 2 |
| Chip lithography | 4 nm | 32 nm |
| Power consumption (TDP) | 54 Watt | 35 Watt |
Ryzen AI 9 HX 375 has a 3916.3% higher aggregate performance score, 2739% faster integrated GPU, an age advantage of 13 years, 500% more physical cores and 1100% more threads, and a 700% more advanced lithography process.
Celeron B810, on the other hand, has 54.3% lower power consumption.
The Ryzen AI 9 HX 375 is our recommended choice as it beats the Celeron B810 in performance tests.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Celeron B810, ask them in Comments section, and we shall answer.
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