3015Ce vs Ryzen AI 9 HX 370
Aggregate performance score
Ryzen AI 9 HX 370 outperforms 3015Ce by a whopping 1566% based on our aggregate benchmark results.
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 256 | 2332 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | no data | AMD Raven Ridge (Ryzen 2000 APU) |
| Power efficiency | 74.50 | 20.87 |
| Designer | AMD | AMD |
| Manufacturer | TSMC | no data |
| Architecture codename | Strix Point (2024−2025) | Pollock (Zen) (2020) |
| Release date | July 2024 (recently) | 4 August 2020 (4 years ago) |
Detailed specifications
Ryzen AI 9 HX 370 and 3015Ce basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
| Threads | 24 | 4 |
| Base clock speed | 2 GHz | 1.2 GHz |
| Boost clock speed | 5.1 GHz | 2.3 GHz |
| Bus rate | 54 MHz | no data |
| L1 cache | 80 KB (per core) | 192 KB |
| L2 cache | 1 MB (per core) | 1 MB |
| L3 cache | 24 MB (shared) | 4 MB |
| Chip lithography | 4 nm | 14 nm |
| Die size | 233 mm2 | no data |
| Maximum core temperature | 100 °C | 105 °C |
| 64 bit support | + | + |
Compatibility
Information on Ryzen AI 9 HX 370 and 3015Ce compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | FP8 | FT5 |
| Power consumption (TDP) | 28 Watt | 6 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 370 and 3015Ce. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME |
| AES-NI | + | + |
| FMA | - | + |
| AVX | + | + |
| Precision Boost 2 | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 370 and 3015Ce are enumerated here.
| AMD-V | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 370 and 3015Ce. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | AMD Radeon RX Vega 3 ( - 600 MHz) |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 370 and 3015Ce.
| PCIe version | 4.0 | no data |
| PCI Express lanes | 16 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance. Other than that, Passmark measures multi-core performance.
Geekbench 5.5 Multi-Core
WebXPRT 3
Pros & cons summary
| Performance score | 21.82 | 1.31 |
| Integrated graphics card | 18.93 | 2.57 |
| Physical cores | 12 | 2 |
| Threads | 24 | 4 |
| Chip lithography | 4 nm | 14 nm |
| Power consumption (TDP) | 28 Watt | 6 Watt |
Ryzen AI 9 HX 370 has a 1565.6% higher aggregate performance score, 636.6% faster integrated GPU, 500% more physical cores and 500% more threads, and a 250% more advanced lithography process.
3015Ce, on the other hand, has 366.7% lower power consumption.
The AMD Ryzen AI 9 HX 370 is our recommended choice as it beats the AMD 3015Ce in performance tests.
Other comparisons
We've compiled a selection of CPU comparisons, ranging from closely matched processors to other comparisons that may be of interest.
