Celeron B860E vs Ryzen AI 7 350
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 553 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | no data | Intel Celeron |
| Power efficiency | 20.98 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | no data |
| Architecture codename | Krackan Point (2025) | Sandy Bridge (2011−2013) |
| Release date | 6 January 2025 (less than a year ago) | no data |
Detailed specifications
Ryzen AI 7 350 and Celeron B860E basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 8 (Octa-Core) | 2 (Dual-core) |
| Threads | 16 | 2 |
| Base clock speed | 2 GHz | no data |
| Boost clock speed | 5 GHz | 2.1 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | no data | 4 × 5 GT/s |
| Multiplier | no data | 21 |
| L1 cache | 80 KB (per core) | 128 KB |
| L2 cache | 1 MB (per core) | 512 KB |
| L3 cache | 8 MB | 2 MB |
| Chip lithography | 4 nm | 32 nm |
| Die size | 195 mm2 | 131 mm2 |
| Number of transistors | no data | 504 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 7 350 and Celeron B860E compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | FP8 | no data |
| Power consumption (TDP) | 28 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 7 350 and Celeron B860E. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | - |
| FMA | - | + |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| Precision Boost 2 | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 7 350 and Celeron B860E are enumerated here.
| AMD-V | + | - |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 7 350 and Celeron B860E. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | no data |
| Maximum memory size | no data | 16 GB |
| Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 860M | Intel HD Graphics (Sandy Bridge) |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 7 350 and Celeron B860E.
| PCIe version | 4.0 | no data |
| PCI Express lanes | 16 | no data |
Pros & cons summary
| Integrated graphics card | 11.55 | 0.33 |
| Physical cores | 8 | 2 |
| Threads | 16 | 2 |
| Chip lithography | 4 nm | 32 nm |
| Power consumption (TDP) | 28 Watt | 35 Watt |
Ryzen AI 7 350 has 3400% faster integrated GPU, 300% more physical cores and 700% more threads, a 700% more advanced lithography process, and 25% lower power consumption.
We couldn't decide between AMD Ryzen AI 7 350 and Intel Celeron B860E. We've got no test results to judge.
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