Mobile Pentium II 300 vs Ryzen 9 7900X3D
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 198 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 50.34 | no data |
| Market segment | Desktop processor | Laptop |
| Series | AMD Ryzen 9 | Intel Mobile Pentium II |
| Power efficiency | 10.08 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | no data |
| Architecture codename | Raphael (2023−2025) | P6 |
| Release date | 4 January 2023 (2 years ago) | no data |
| Launch price (MSRP) | $599 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
Ryzen 9 7900X3D and Mobile Pentium II 300 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 1 (Single-Core) |
| Threads | 24 | 1 |
| Base clock speed | 4.4 GHz | no data |
| Boost clock speed | 5.6 GHz | 0.3 GHz |
| Bus type | no data | FSB |
| Multiplier | no data | 4.5 |
| L1 cache | 64K (per core) | no data |
| L2 cache | 1 MB (per core) | 512 KB |
| L3 cache | 128 MB (shared) | no data |
| Chip lithography | 5 nm, 6 nm | 250 nm |
| Die size | 2x 71 mm2 | 131 mm2 |
| Maximum case temperature (TCase) | 47 °C | no data |
| Number of transistors | 13,140 million | 8 Million |
| 64 bit support | + | - |
| Windows 11 compatibility | + | no data |
| Unlocked multiplier | + | - |
Compatibility
Information on Ryzen 9 7900X3D and Mobile Pentium II 300 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | AM5 | no data |
| Power consumption (TDP) | 120 Watt | 11.1 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen 9 7900X3D and Mobile Pentium II 300. You'll probably need this information if you require some particular technology.
| AES-NI | + | - |
| AVX | + | - |
| Precision Boost 2 | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen 9 7900X3D and Mobile Pentium II 300 are enumerated here.
| AMD-V | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen 9 7900X3D and Mobile Pentium II 300. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5-5200 | no data |
| Maximum memory size | 128 GB | 64 GB |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon Graphics | no data |
Peripherals
Specifications and connection of peripherals supported by Ryzen 9 7900X3D and Mobile Pentium II 300.
| PCIe version | 5.0 | no data |
| PCI Express lanes | 24 | no data |
Pros & cons summary
| Physical cores | 12 | 1 |
| Threads | 24 | 1 |
| Chip lithography | 5 nm | 250 nm |
| Power consumption (TDP) | 120 Watt | 11 Watt |
Ryzen 9 7900X3D has 1100% more physical cores and 2300% more threads, and a 4900% more advanced lithography process.
Mobile Pentium II 300, on the other hand, has 990.9% lower power consumption.
We couldn't decide between AMD Ryzen 9 7900X3D and Intel Mobile Pentium II 300. We've got no test results to judge.
Note that Ryzen 9 7900X3D is a desktop processor while Mobile Pentium II 300 is a notebook one.
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